- Attachment Method：
-
- Power Dissipation @ Temperature Rise：
-
- Thermal Resistance @ Forced Air Flow：
-
- Thermal Resistance @ Natural：
-
- Condiciones seleccionadas:
Descubre los productos 5
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Attachment Method | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Attachment Method | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | |
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Aavid, Thermal Division of Boyd Corporation |
9,699
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
TOP MOUNT HEATSINK .4" D-PAK
|
SMD Pad | 0.8W @ 30°C | 12.50°C/W @ 600 LFM | 15.00°C/W | ||
|
|
|
Aavid, Thermal Division of Boyd Corporation |
4,750
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK SMT D-PAK/TO-252 TIN
|
SMD Pad | 0.8W @ 30°C | 12.50°C/W @ 600 LFM | 15.00°C/W | ||
|
|
|
Aavid, Thermal Division of Boyd Corporation |
4,764
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK SMT D-PAK/TO-252 TIN
|
SMD Pad | 0.8W @ 30°C | 12.50°C/W @ 600 LFM | 15.00°C/W | ||
|
|
|
CUI Inc. |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK, STAMPING, TO-252, 8 X
|
- | 2.1W @ 75°C | 10.05°C/W @ 200 LFM | 35.71°C/W | ||
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Comair Rotron |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK STAMP 22.9X8X10.2MM
|
SMD Pad | 2.5W @ 35°C | 17.50°C/W @ 300 LFM | - |
