- Series：
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- Width：
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- Attachment Method：
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- Package Cooled：
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- Height Off Base (Height of Fin)：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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- Material Finish：
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- Condiciones seleccionadas:
Descubre los productos 1,029
 |
La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Type | Width | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Type | Width | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | |
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Wakefield-Vette |
913
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-220/TO-247 SCREW
|
678 | Board Level, Vertical | 0.984" (25.00mm) | Bolt On and Board Mounts | Assorted (BGA, LGA, CPU, ASIC...) | 1.520" (38.61mm) | 0.60°C/W @ 600 LFM | - | Black Anodized | ||
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|
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Wakefield-Vette |
903
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-220/TO-247 W/CLIP
|
678 | Board Level, Vertical | 0.984" (25.00mm) | Clip, Solder Foot | Assorted (BGA, LGA, CPU, ASIC...) | 1.520" (38.61mm) | 0.60°C/W @ 600 LFM | - | Black Anodized | ||
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|
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ASSMANN WSW Components |
420
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK ALUM ANOD
|
- | Board Level | 0.748" (19.00mm) | Bolt On and PC Pin | SOT-32, TO-220 | 0.844" (21.44mm) | - | 7.50°C/W | Black Anodized | ||
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Advanced Thermal Solutions Inc. |
54
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 60X60X9.5MM XCUT SFP
|
pushPIN | Top Mount | 2.362" (60.00mm) | Push Pin | Assorted (BGA, LGA, CPU, ASIC...) | 0.374" (9.50mm) | 26.74°C/W @ 100 LFM | - | Blue Anodized | |||
|
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Advanced Thermal Solutions Inc. |
72
|
3 dias |
-
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MOQ: 1 MPQ: 1
|
HEATSINK 60X60X12.7MM XCUT SFP
|
pushPIN | Top Mount | 1.575" (40.01mm) | Push Pin | Assorted (BGA, LGA, CPU, ASIC...) | 0.500" (12.70mm) | 26.30°C/W @ 100 LFM | - | Blue Anodized | |||
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|
Advanced Thermal Solutions Inc. |
Consulta
|
- |
-
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MOQ: 1 MPQ: 1
|
HEATSINK 60X60X9.5MM XCUT SFP
|
pushPIN | Top Mount | 1.575" (40.01mm) | Push Pin | Assorted (BGA, LGA, CPU, ASIC...) | 0.374" (9.50mm) | 26.72°C/W @ 100 LFM | - | Blue Anodized | |||
|
|
Advanced Thermal Solutions Inc. |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 60X60X12.7MM XCUT SFP
|
pushPIN | Top Mount | 1.575" (40.01mm) | Push Pin | Assorted (BGA, LGA, CPU, ASIC...) | 0.500" (12.70mm) | 26.29°C/W @ 100 LFM | - | Blue Anodized | |||
|
|
Advanced Thermal Solutions Inc. |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 60X60X9.5MM XCUT SFP
|
pushPIN | Top Mount | 1.575" (40.01mm) | Push Pin | Assorted (BGA, LGA, CPU, ASIC...) | 0.374" (9.50mm) | 26.82°C/W @ 100 LFM | - | Blue Anodized | |||
|
|
Advanced Thermal Solutions Inc. |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 60X60X12.7MM XCUT SFP
|
pushPIN | Top Mount | 1.575" (40.01mm) | Push Pin | Assorted (BGA, LGA, CPU, ASIC...) | 0.500" (12.70mm) | 26.38°C/W @ 100 LFM | - | Blue Anodized | |||
|
|
Advanced Thermal Solutions Inc. |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 60X40X9.5MM XCUT
|
pushPIN | Top Mount | 1.575" (40.01mm) | Push Pin | Assorted (BGA, LGA, CPU, ASIC...) | 0.374" (9.50mm) | 26.72°C/W @ 100 LFM | - | Blue Anodized | |||
|
|
Advanced Thermal Solutions Inc. |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 60X40X12.7MM XCUT
|
pushPIN | Top Mount | 1.575" (40.01mm) | Push Pin | Assorted (BGA, LGA, CPU, ASIC...) | 0.500" (12.70mm) | 26.29°C/W @ 100 LFM | - | Blue Anodized | |||
|
|
Advanced Thermal Solutions Inc. |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 60X40X9.5MM XCUT
|
pushPIN | Top Mount | 1.575" (40.01mm) | Push Pin | Assorted (BGA, LGA, CPU, ASIC...) | 0.374" (9.50mm) | 26.72°C/W @ 100 LFM | - | Blue Anodized | |||
|
|
Advanced Thermal Solutions Inc. |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 60X40X9.5MM XCUT
|
pushPIN | Top Mount | 1.575" (40.01mm) | Push Pin | Assorted (BGA, LGA, CPU, ASIC...) | 0.374" (9.50mm) | 26.72°C/W @ 100 LFM | - | Blue Anodized | |||
|
|
Advanced Thermal Solutions Inc. |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 60X40X9.5MM XCUT
|
pushPIN | Top Mount | 1.575" (40.01mm) | Push Pin | Assorted (BGA, LGA, CPU, ASIC...) | 0.374" (9.50mm) | 26.72°C/W @ 100 LFM | - | Blue Anodized | |||
|
|
Advanced Thermal Solutions Inc. |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 60X40X9.5MM XCUT
|
pushPIN | Top Mount | 1.575" (40.01mm) | Push Pin | Assorted (BGA, LGA, CPU, ASIC...) | 0.374" (9.50mm) | 26.72°C/W @ 100 LFM | - | Blue Anodized | |||
|
|
Advanced Thermal Solutions Inc. |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 60X40X9.5MM XCUT
|
pushPIN | Top Mount | 1.575" (40.01mm) | Push Pin | Assorted (BGA, LGA, CPU, ASIC...) | 0.374" (9.50mm) | 26.72°C/W @ 100 LFM | - | Blue Anodized | |||
|
|
Advanced Thermal Solutions Inc. |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 60X40X9.5MM XCUT
|
pushPIN | Top Mount | 1.575" (40.01mm) | Push Pin | Assorted (BGA, LGA, CPU, ASIC...) | 0.374" (9.50mm) | 26.72°C/W @ 100 LFM | - | Blue Anodized | |||
|
|
Advanced Thermal Solutions Inc. |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 60X40X9.5MM XCUT
|
pushPIN | Top Mount | 1.575" (40.01mm) | Push Pin | Assorted (BGA, LGA, CPU, ASIC...) | 0.374" (9.50mm) | 26.72°C/W @ 100 LFM | - | Blue Anodized | |||
|
|
Advanced Thermal Solutions Inc. |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 60X40X9.5MM XCUT
|
pushPIN | Top Mount | 1.575" (40.01mm) | Push Pin | Assorted (BGA, LGA, CPU, ASIC...) | 0.374" (9.50mm) | 26.72°C/W @ 100 LFM | - | Blue Anodized | |||
|
|
Advanced Thermal Solutions Inc. |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 60X40X9.5MM XCUT
|
pushPIN | Top Mount | 1.575" (40.01mm) | Push Pin | Assorted (BGA, LGA, CPU, ASIC...) | 0.374" (9.50mm) | 26.72°C/W @ 100 LFM | - | Blue Anodized |
