Fabricante:
Attachment Method:
Power Dissipation @ Temperature Rise:
Thermal Resistance @ Natural:
Descubre los productos 4
La imagen Número de pieza Fabricante Cantidad Plazo de entrega Precio unitario Comprar Descripción Type Attachment Method Power Dissipation @ Temperature Rise Thermal Resistance @ Natural
573902B04000G
Aavid, Thermal Division of Boyd Corporation
1,014
3 dias
-
MOQ: 1  MPQ: 1
HEATSINK TO-220 CLIP-ON/TAB
Board Level, Vertical Clip and PC Pin 3.0W @ 60°C 18.80°C/W
573902B00000G
Aavid, Thermal Division of Boyd Corporation
1,742
3 dias
-
MOQ: 1  MPQ: 1
HEATSINK TO-220 BLACK CLIP-ON
Board Level Clip 3.0W @ 60°C 18.80°C/W
ATS-PCB1003
Advanced Thermal Solutions Inc.
2,948
3 dias
-
MOQ: 1  MPQ: 1
HEATSINK TO-220 CLIPON W/TAB
Board Level, Vertical Clip and PC Pin - 20.00°C/W
573902B03900G
Aavid, Thermal Division of Boyd Corporation
Consulta
-
-
MOQ: 1  MPQ: 1
BOARD LEVEL HEAT SINK
Board Level, Vertical Clip and PC Pin 3.0W @ 60°C 18.80°C/W