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- Condiciones seleccionadas:
Descubre los productos 2
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Type | Material | Length | Width | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Thermal Resistance @ Forced Air Flow | Material Finish | |
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Type | Material | Length | Width | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Thermal Resistance @ Forced Air Flow | Material Finish | |
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Comair Rotron |
Consulta
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MOQ: 1 MPQ: 1
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HEATSINK STAMP 19.4X25.4X11.4MM
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Board Level | Copper | 0.763" (19.38mm) | 1.000" (25.40mm) | SMD Pad | TO-263 (D2Pak) | 0.450" (11.43mm) | 4.00°C/W @ 200 LFM | Tin | ||
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Comair Rotron |
Consulta
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MOQ: 1 MPQ: 1
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HEATSINK EXTRUDED 16X16.5X50.8MM
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Board Level, Vertical | Aluminum | 2.000" (50.80mm) | 0.650" (16.51mm) | Bolt On and PC Pin | TO-220, TO-218 | 0.630" (16.00mm) | 2.00°C/W @ 800 LFM | Black Anodized |
