- Attachment Method：
-
- Power Dissipation @ Temperature Rise：
-
- Thermal Resistance @ Forced Air Flow：
-
Descubre los productos 4
 |
La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Attachment Method | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Attachment Method | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | |
|
Advanced Thermal Solutions Inc. |
211
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK 19MM X 19MM X 24.5MM
|
Thermal Tape, Adhesive (Included) | - | 7.10°C/W @ 200 LFM | |||
|
|
Advanced Thermal Solutions Inc. |
52
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK 19MM X 19MM X 24.5MM
|
Thermal Tape, Adhesive (Included) | 0.3W @ 20°C | 6.50°C/W @ 200 LFM | |||
|
|
Advanced Thermal Solutions Inc. |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 19X19X24.5MM W/OUT TIM
|
Thermal Tape, Adhesive (Not Included) | 0.3W @ 20°C | 6.50°C/W @ 200 LFM | |||
|
|
Advanced Thermal Solutions Inc. |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 19X19X24.5MM W/OUT TIM
|
Thermal Tape, Adhesive (Not Included) | - | 7.10°C/W @ 200 LFM |
