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- Length：
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- Width：
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- Attachment Method：
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- Height Off Base (Height of Fin)：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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- Material Finish：
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- Condiciones seleccionadas:
Descubre los productos 14
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Type | Material | Length | Width | Attachment Method | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Type | Material | Length | Width | Attachment Method | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | |
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Aavid, Thermal Division of Boyd Corporation |
17,584
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3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK TO-220 VERT MNT W/TAB
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- | Board Level, Vertical | Aluminum | 1.375" (34.93mm) | 0.860" (21.84mm) | Clip and PC Pin | 0.395" (10.03mm) | 2.5W @ 40°C | 6.00°C/W @ 400 LFM | 16.00°C/W | Black Anodized | ||
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Aavid, Thermal Division of Boyd Corporation |
7,570
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3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK TO-220 LOCKING TAB CLIP
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- | Board Level | Aluminum | 0.800" (20.32mm) | 0.268" (6.81mm) | Clip | 1.000" (25.40mm) | 1.5W @ 40°C | 4.00°C/W @ 500 LFM | 23.00°C/W | Black Anodized | ||
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Advanced Thermal Solutions Inc. |
1,230
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3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK TO-220 CLIP-ON BLACK
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- | Board Level | Aluminum | 0.748" (19.00mm) | 0.504" (12.80mm) | Clip | 0.500" (12.70mm) | - | 10.20°C/W @ 200 LFM | 27.30°C/W | Black Anodized | |||
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Advanced Thermal Solutions Inc. |
970
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3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK TO-220 STEEL W/TAB
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- | Board Level, Vertical | Steel | 0.787" (20.00mm) | 1.220" (30.99mm) | PC Pin | 0.032" (0.80mm) | - | 13.00°C/W @ 200 LFM | 25.00°C/W | Tin | |||
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CUI Inc. |
988
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3 dias |
-
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MOQ: 1 MPQ: 1
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HEAT SINK, EXTRUSION, TO-220, 25
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HSE | Board Level | Aluminum Alloy | 0.984" (25.00mm) | 0.625" (16.00mm) | Bolt On | 0.354" (9.00mm) | 3.8W @ 75°C | 6.12°C/W @ 200 LFM | 19.74°C/W | Black Anodized | ||
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Advanced Thermal Solutions Inc. |
Consulta
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- |
-
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MOQ: 1 MPQ: 1
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HEATSINK CLIP-ON TO-220 BLACK
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- | Board Level | Aluminum | 1.035" (26.29mm) | 0.799" (20.30mm) | Adhesive | 0.241" (6.11mm) | - | 6.50°C/W @ 200 LFM | 23.00°C/W | Black Anodized | |||
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Aavid, Thermal Division of Boyd Corporation |
Consulta
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- |
-
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MOQ: 1 MPQ: 1
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BOARD LEVEL HEAT SINK
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- | Board Level, Vertical | Aluminum | 1.675" (42.55mm) | 1.000" (25.40mm) | Bolt On and PC Pin | 1.000" (25.40mm) | 4.0W @ 40°C | 4.00°C/W @ 300 LFM | 11.20°C/W | Black Anodized | ||
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Aavid, Thermal Division of Boyd Corporation |
Consulta
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- |
-
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MOQ: 1 MPQ: 1
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BOARD LEVEL HEAT SINK
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- | Board Level, Vertical | Aluminum | 0.750" (19.05mm) | 0.860" (21.84mm) | Clip and PC Pin | 0.395" (10.03mm) | 2.0W @ 50°C | 8.00°C/W @ 500 LFM | 23.20°C/W | Black Anodized | ||
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Aavid, Thermal Division of Boyd Corporation |
Consulta
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- |
-
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MOQ: 1 MPQ: 1
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BOARD LEVEL HEAT SINK
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- | Board Level | Aluminum | 1.000" (25.40mm) | 0.750" (19.05mm) | Clip | 0.350" (8.89mm) | 1.0W @ 30°C | 16.00°C/W @ 200 LFM | 26.00°C/W | Black Anodized | ||
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Aavid, Thermal Division of Boyd Corporation |
Consulta
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- |
-
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MOQ: 1 MPQ: 1
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BOARD LEVEL HEAT SINK
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- | Board Level, Vertical | - | 1.675" (42.55mm) | 1.000" (25.40mm) | Bolt On and PC Pin | 1.000" (25.40mm) | 1.5W @ 20°C | 3.00°C/W @ 700 LFM | 12.40°C/W | Tin | ||
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Comair Rotron |
Consulta
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- |
-
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MOQ: 1 MPQ: 1
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HEATSINK STAMP 10X21.2X19MM
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- | Board Level | Aluminum | 0.750" (19.05mm) | 0.860" (21.84mm) | Bolt On | 0.355" (9.02mm) | 3.0W @ 60°C | 12.00°C/W @ 200 LFM | - | Black Anodized | ||
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Comair Rotron |
Consulta
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- |
-
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MOQ: 1 MPQ: 1
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HEATSINK STAMP 10X21.2X19MM
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- | Board Level, Vertical | Aluminum | 0.750" (19.05mm) | 0.835" (21.21mm) | Bolt On and PC Pin | 0.394" (10.00mm) | 3.0W @ 60°C | 12.00°C/W @ 200 LFM | - | Black Anodized | ||
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Comair Rotron |
Consulta
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- |
-
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MOQ: 1 MPQ: 1
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HEATSINK STAMP 20X5X25MM
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- | Board Level | Aluminum | 0.984" (25.00mm) | 0.787" (20.00mm) | Clip | 0.197" (5.00mm) | 1.5W @ 40°C | 4.00°C/W @ 500 LFM | - | Black Anodized | ||
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ASSMANN WSW Components |
Consulta
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- |
-
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MOQ: 1 MPQ: 1
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HEATSINK ALUM ANOD
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- | Board Level, Vertical | Aluminum | 0.787" (20.00mm) | 0.984" (25.00mm) | PC Pin | 0.394" (10.00mm) | - | - | 35.00°C/W | Tin |
