- Attachment Method：
-
- Power Dissipation @ Temperature Rise：
-
- Thermal Resistance @ Forced Air Flow：
-
- Condiciones seleccionadas:
Descubre los productos 11
 |
La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Length | Width | Attachment Method | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Length | Width | Attachment Method | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | |
|
|
|
Wakefield-Vette |
17,584
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK CPU 21MM SQ W/DBL TAPE
|
624 | 0.827" (21.00mm) | 0.827" (21.00mm) | Thermal Tape, Adhesive (Included) | - | 25.00°C/W @ 200 LFM | ||
|
|
|
Wakefield-Vette |
4,845
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK CPU 25MM SQ W/DBL TAPE
|
625 | 0.984" (25.00mm) | 0.984" (25.00mm) | Thermal Tape, Adhesive (Included) | - | 12.00°C/W @ 500 LFM | ||
|
|
|
Wakefield-Vette |
5,350
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK CPU 28MM SQ BLK W/TAPE
|
658 | 1.100" (27.94mm) | 1.100" (27.94mm) | Adhesive | 2.0W @ 40°C | 5.00°C/W @ 500 LFM | ||
|
|
|
Wakefield-Vette |
3,457
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK CPU 28MM SQ BLK
|
658 | 1.100" (27.94mm) | 1.100" (27.94mm) | Thermal Tape, Adhesive (Not Included) | 2.0W @ 40°C | 5.00°C/W @ 500 LFM | ||
|
|
|
Wakefield-Vette |
839
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK CPU 28MM SQ BLK W/TAPE
|
658 | 1.100" (27.94mm) | 1.100" (27.94mm) | Thermal Tape, Adhesive (Included) | 2.0W @ 40°C | 5.00°C/W @ 500 LFM | ||
|
|
|
Wakefield-Vette |
642
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK CPU 28MM SQ BLK W/TAPE
|
658 | 1.100" (27.94mm) | 1.100" (27.94mm) | Thermal Tape, Adhesive (Included) | 2.0W @ 40°C | 5.00°C/W @ 500 LFM | ||
|
|
|
Wakefield-Vette |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK CPU 21MM SQ W/DBL TAPE
|
624 | 0.827" (21.00mm) | 0.827" (21.00mm) | Thermal Tape, Adhesive (Included) | - | 25.00°C/W @ 200 LFM | ||
|
|
|
Wakefield-Vette |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK CPU 25MM SQ W/DBL TAPE
|
625 | 0.984" (25.00mm) | 0.984" (25.00mm) | Thermal Tape, Adhesive (Included) | - | 12.00°C/W @ 500 LFM | ||
|
|
|
Wakefield-Vette |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK CPU 28MM SQ BLK W/TAPE
|
658 | 1.100" (27.94mm) | 1.100" (27.94mm) | Thermal Tape, Adhesive (Included) | 2.0W @ 40°C | 5.00°C/W @ 500 LFM | ||
|
|
|
Wakefield-Vette |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK CPU 28MM SQ BLK W/TAPE
|
658 | 1.100" (27.94mm) | 1.100" (27.94mm) | Thermal Tape, Adhesive (Included) | 2.0W @ 40°C | 5.00°C/W @ 500 LFM | ||
|
|
|
Wakefield-Vette |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK CPU 28MM SQ BLK W/TAPE
|
658 | 1.100" (27.94mm) | 1.100" (27.94mm) | Thermal Tape, Adhesive (Included) | 2.0W @ 40°C | 5.00°C/W @ 500 LFM |
