- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Condiciones seleccionadas:
Descubre los productos 5
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Type | Width | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Type | Width | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | |
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Aavid, Thermal Division of Boyd Corporation |
10,548
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO220 CLIPON W/TAB.75"
|
Board Level | 0.500" (12.70mm) | 1.0W @ 30°C | 7.00°C/W @ 400 LFM | ||
|
|
Advanced Thermal Solutions Inc. |
2,962
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-220/TO262 CLIP W/TAB
|
Board Level, Vertical | 0.504" (12.80mm) | - | 10.20°C/W @ 200 LFM | |||
|
|
Advanced Thermal Solutions Inc. |
1,985
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-220/TO-262 W/TAB
|
Board Level, Vertical | 0.504" (12.80mm) | - | 10.20°C/W @ 200 LFM | |||
|
|
Advanced Thermal Solutions Inc. |
1,867
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-220 CLIPON W/TAB
|
Board Level, Vertical | 0.504" (12.80mm) | - | 10.20°C/W @ 200 LFM | |||
|
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|
Aavid, Thermal Division of Boyd Corporation |
Consulta
|
- |
-
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MOQ: 1 MPQ: 1
|
BOARD LEVEL HEAT SINK
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Board Level, Vertical | 0.500" (12.70mm) | 1.0W @ 30°C | 7.00°C/W @ 400 LFM |
