- Power Dissipation @ Temperature Rise：
-
- Thermal Resistance @ Natural：
-
Descubre los productos 3
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Length | Power Dissipation @ Temperature Rise | Thermal Resistance @ Natural | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Length | Power Dissipation @ Temperature Rise | Thermal Resistance @ Natural | |
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Aavid, Thermal Division of Boyd Corporation |
3,101
|
3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK TO-218 SOLDER PIN
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2.000" (50.80mm) | 12.0W @ 50°C | 4.50°C/W | ||
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Aavid, Thermal Division of Boyd Corporation |
Consulta
|
- |
-
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MOQ: 1 MPQ: 1
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BOARD LEVEL HEAT SINK
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2.500" (63.50mm) | 20.0W @ 60°C | 8.00°C/W | ||
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Aavid, Thermal Division of Boyd Corporation |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
BOARD LEVEL HEAT SINK
|
2.000" (50.80mm) | 12.0W @ 50°C | 4.50°C/W |
