529901B02500G

Descripción :
HEATSINK TO-218 SOLDER PIN
Attachment Method :
Bolt On and PC Pin
Diameter :
-
Height Off Base (Height of Fin) :
1.000" (25.40mm)
Length :
2.000" (50.80mm)
Material :
Aluminum
Material Finish :
Black Anodized
Package Cooled :
TO-218
Power Dissipation @ Temperature Rise :
12.0W @ 50°C
Series :
-
Shape :
Rectangular, Fins
Thermal Resistance @ Forced Air Flow :
1.00°C/W @ 800 LFM
Thermal Resistance @ Natural :
4.50°C/W
Type :
Board Level, Vertical
Width :
1.650" (41.91mm)

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