- Series：
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- Material：
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- Height Off Base (Height of Fin)：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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- Material Finish：
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- Condiciones seleccionadas:
Descubre los productos 5
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Material | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Material | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | |
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Aavid, Thermal Division of Boyd Corporation |
3,250
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK D-PAK3 TIN PLATED SMD
|
- | Copper | D3Pak | 0.401" (10.20mm) | 1.0W @ 20°C | 4.00°C/W @ 600 LFM | 14.00°C/W | Tin | ||
|
|
|
Aavid, Thermal Division of Boyd Corporation |
3,255
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK D-PAK3 TIN PLATED SMD
|
- | Copper | D3Pak | 0.401" (10.20mm) | 1.0W @ 20°C | 4.00°C/W @ 600 LFM | 14.00°C/W | Tin | ||
|
|
|
Aavid, Thermal Division of Boyd Corporation |
3,255
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK D-PAK3 TIN PLATED SMD
|
- | Copper | D3Pak | 0.401" (10.20mm) | 1.0W @ 20°C | 4.00°C/W @ 600 LFM | 14.00°C/W | Tin | ||
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|
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Apex Microtechnology |
31
|
3 dias |
-
|
MOQ: 1 MPQ: 1
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HEATSINK SMT
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Apex Precision Power | Copper | SMD | 0.400" (10.16mm) | - | 16.00°C/W @ 600 LFM | 50.00°C/W | Solderable | ||
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Aavid, Thermal Division of Boyd Corporation |
Consulta
|
- |
-
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MOQ: 1 MPQ: 1
|
BOARD LEVEL HEAT SINK
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- | - | D3Pak | 0.401" (10.20mm) | 1.0W @ 20°C | 4.00°C/W @ 600 LFM | 14.00°C/W | Tin |
