- Height Off Base (Height of Fin)：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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- Condiciones seleccionadas:
Descubre los productos 3
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Type | Length | Width | Height Off Base (Height of Fin) | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | |
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Type | Length | Width | Height Off Base (Height of Fin) | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | |
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Aavid, Thermal Division of Boyd Corporation |
9,535
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3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK TO-220 TIN CLIP-ON 13MM
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Board Level | 0.780" (19.81mm) | 0.520" (13.21mm) | 0.515" (13.08mm) | 8.00°C/W @ 500 LFM | 28.30°C/W | ||
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Aavid, Thermal Division of Boyd Corporation |
Consulta
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-
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MOQ: 1 MPQ: 1
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BOARD LEVEL HEAT SINK
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Board Level, Vertical | 0.848" (21.55mm) | 0.900" (22.86mm) | 0.375" (9.52mm) | 10.00°C/W @ 200 LFM | 20.80°C/W | ||
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Aavid, Thermal Division of Boyd Corporation |
Consulta
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- |
-
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MOQ: 1 MPQ: 1
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BOARD LEVEL HEAT SINK
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Board Level | 0.700" (17.78mm) | 0.900" (22.86mm) | 0.375" (9.52mm) | 10.00°C/W @ 200 LFM | 20.80°C/W |
