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- Condiciones seleccionadas:
Descubre los productos 261
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Type | Material | Length | Width | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | |
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Type | Material | Length | Width | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | |
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Advanced Thermal Solutions Inc. |
Consulta
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-
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MOQ: 1 MPQ: 1
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MAXIGRIP FANSINK 32.5X24.5MM
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fanSINK, maxiGRIP | Top Mount | Aluminum | 1.279" (32.50mm) | 1.279" (32.50mm) | Clip, Thermal Material | BGA | 0.964" (24.50mm) | - | 1.60°C/W @ 200 LFM | - | Black Anodized | |||
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Advanced Thermal Solutions Inc. |
Consulta
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-
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MOQ: 1 MPQ: 1
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MAXIGRIP FANSINK 33X33X24.5MM
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fanSINK, maxiGRIP | Top Mount | Aluminum | 1.299" (32.99mm) | 1.299" (32.99mm) | Clip, Thermal Material | BGA | 0.964" (24.50mm) | - | 1.55°C/W @ 200 LFM | - | Black Anodized | |||
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Advanced Thermal Solutions Inc. |
Consulta
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- |
-
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MOQ: 1 MPQ: 1
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MAXIGRIP FANSINK 37.5X24.5MM
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fanSINK, maxiGRIP | Top Mount | Aluminum | 1.476" (37.50mm) | 1.476" (37.50mm) | Clip, Thermal Material | BGA | 0.964" (24.50mm) | - | 1.40°C/W @ 200 LFM | - | Black Anodized | |||
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Advanced Thermal Solutions Inc. |
Consulta
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- |
-
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MOQ: 1 MPQ: 1
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MAXIGRIP FANSINK 42.5X24.5MM
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fanSINK, maxiGRIP | Top Mount | Aluminum | 1.673" (42.49mm) | 1.673" (42.49mm) | Clip, Thermal Material | BGA | 0.964" (24.50mm) | - | 1.20°C/W @ 200 LFM | - | Black Anodized | |||
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t-Global Technology |
Consulta
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-
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MOQ: 1 MPQ: 1
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CERAMIC HEATSINK
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- | Top Mount | Ceramic | 0.472" (12.00mm) | 0.472" (12.00mm) | Thermal Tape, Adhesive (Included) | - | 0.394" (10.00mm) | - | - | - | - | ||
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Apex Microtechnology |
2
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3 dias |
-
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MOQ: 1 MPQ: 1
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HEATSINK 6P DIP
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Apex Precision Power | Board Level | Aluminum | 2.500" (63.50mm) | 2.500" (63.50mm) | Bolt On | 6-DIP | 0.900" (22.86mm) | 3.0W @ 20°C | 30.00°C/W @ 500 LFM | 5.60°C/W | Black Anodized | ||
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Wakefield-Vette |
Consulta
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-
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MOQ: 1 MPQ: 1
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HEATSINK CPU 21MM SQ W/OUT ADH
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624 | Top Mount | Aluminum | 0.827" (21.00mm) | 0.827" (21.00mm) | Thermal Tape, Adhesive (Not Included) | BGA | 0.450" (11.43mm) | - | 15.00°C/W @ 200 LFM | - | Black Anodized | ||
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Wakefield-Vette |
Consulta
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-
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MOQ: 1 MPQ: 1
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HEATSINK FOR BGAS FIN HGT .45"
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630 | Top Mount | Aluminum | 1.378" (35.00mm) | 1.378" (35.00mm) | Thermal Tape, Adhesive (Not Included) | BGA | 0.450" (11.43mm) | - | 4.00°C/W @ 400 LFM | - | Black Anodized | ||
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Wakefield-Vette |
Consulta
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-
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MOQ: 1 MPQ: 1
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HEATSINK FOR BGA 35MM
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630 | Top Mount | Aluminum | 1.378" (35.00mm) | 1.378" (35.00mm) | Thermal Tape, Adhesive (Not Included) | BGA | 0.598" (15.20mm) | - | 3.00°C/W @ 350 LFM | - | Black Anodized | ||
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Wakefield-Vette |
Consulta
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-
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MOQ: 1 MPQ: 1
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HEATSINK FOR BGAS FIN HGT .45"
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630 | Top Mount | Aluminum | 1.378" (35.00mm) | 1.378" (35.00mm) | Adhesive | BGA | 0.450" (11.43mm) | - | 4.00°C/W @ 400 LFM | - | Black Anodized | ||
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Wakefield-Vette |
Consulta
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- |
-
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MOQ: 1 MPQ: 1
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HEATSINK CPU 21MM SQ
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624 | Top Mount | Aluminum | 0.827" (21.00mm) | 0.827" (21.00mm) | Thermal Tape, Adhesive (Included) | BGA | 0.450" (11.43mm) | - | 15.00°C/W @ 200 LFM | - | Black Anodized | ||
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Wakefield-Vette |
Consulta
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- |
-
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MOQ: 1 MPQ: 1
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HEATSINK CPU 25MM SQ W/DBL TAPE
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625 | Top Mount | Aluminum | 0.984" (25.00mm) | 0.984" (25.00mm) | Adhesive | BGA | 0.450" (11.43mm) | - | 8.00°C/W @ 400 LFM | - | Black Anodized | ||
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Wakefield-Vette |
Consulta
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-
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MOQ: 1 MPQ: 1
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HEATSINK CPU 43MM SQ BLK H=.65"
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628 | Top Mount | Aluminum | 1.750" (44.45mm) | 1.700" (43.18mm) | Thermal Tape, Adhesive (Included) | Assorted (BGA, LGA, CPU, ASIC...) | 0.650" (16.51mm) | 3.0W @ 20°C | 2.00°C/W @ 400 LFM | - | Black Anodized | ||
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CTS Thermal Management Products |
Consulta
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- |
-
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MOQ: 1 MPQ: 1
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HEATSINK CPU W/ADHESIVE 1.51"SQ
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BDN | Top Mount | Aluminum | 1.510" (38.35mm) | 1.510" (38.35mm) | Thermal Tape, Adhesive (Included) | Assorted (BGA, LGA, CPU, ASIC...) | 0.355" (9.02mm) | - | 4.50°C/W @ 400 LFM | 15.10°C/W | Black Anodized | ||
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Wakefield-Vette |
Consulta
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-
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MOQ: 1 MPQ: 1
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HEATSINK 100PQFP COMPOSITE
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Deltem | Top Mount | Composite | 0.650" (16.51mm) | 0.650" (16.51mm) | Thermal Tape, Adhesive (Included) | BGA | 0.400" (10.16mm) | 2.0W @ 40°C | 25.00°C/W @ 350 LFM | - | - | ||
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Wakefield-Vette |
Consulta
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-
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MOQ: 1 MPQ: 1
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HEATSINK 100PQFP COMPOSITE
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Deltem | Top Mount | Composite | 0.650" (16.51mm) | 0.650" (16.51mm) | Thermal Tape, Adhesive (Included) | BGA | 0.400" (10.16mm) | 2.0W @ 40°C | 25.00°C/W @ 350 LFM | - | - | ||
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Wakefield-Vette |
Consulta
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-
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MOQ: 1 MPQ: 1
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HEATSINK 100PQFP COMPOSITE
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Deltem | Top Mount | Composite | 0.650" (16.51mm) | 0.650" (16.51mm) | Thermal Tape, Adhesive (Included) | BGA | 0.400" (10.16mm) | 2.0W @ 40°C | 25.00°C/W @ 350 LFM | - | - | ||
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Wakefield-Vette |
Consulta
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-
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MOQ: 1 MPQ: 1
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HEATSINK 100PQFP COMPOSITE
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Deltem | Top Mount | Composite | 0.650" (16.51mm) | 0.650" (16.51mm) | Thermal Tape, Adhesive (Included) | BGA | 0.400" (10.16mm) | 2.0W @ 40°C | 25.00°C/W @ 350 LFM | - | - | ||
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Aavid, Thermal Division of Boyd Corporation |
Consulta
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- |
-
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MOQ: 1 MPQ: 1
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BOARD LEVEL HEAT SINK
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- | Board Level | Aluminum | 1.810" (45.97mm) | 1.810" (45.97mm) | Bolt On | TO-3 | 1.250" (31.75mm) | 10.0W @ 50°C | 1.50°C/W @ 600 LFM | 5.10°C/W | Black Anodized | ||
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Aavid, Thermal Division of Boyd Corporation |
Consulta
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-
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MOQ: 1 MPQ: 1
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BOARD LEVEL HEAT SINK
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- | Board Level | Aluminum | 1.810" (45.97mm) | 1.810" (45.97mm) | Bolt On | TO-3 | 0.750" (19.05mm) | 12.0W @ 70°C | 1.50°C/W @ 700 LFM | 6.20°C/W | Black Anodized |
