- Series:
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- Material:
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- Length:
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- Width:
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- Attachment Method:
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- Package Cooled:
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- Height Off Base (Height of Fin):
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- Power Dissipation @ Temperature Rise:
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- Thermal Resistance @ Forced Air Flow:
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- Thermal Resistance @ Natural:
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- Material Finish:
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- Condiciones seleccionadas:
Descubre los productos 261
La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Type | Material | Length | Width | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | ||
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Type | Material | Length | Width | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | ||
Wakefield-Vette |
191
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 35X35X12MM PIN
|
908 | Top Mount | Aluminum | 1.378" (35.00mm) | 1.378" (35.00mm) | Clip | BGA | 0.457" (11.60mm) | - | 3.10°C/W @ 200 LFM | 11.10°C/W | Black Anodized | ||||
Advanced Thermal Solutions Inc. |
109
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK 27MM X 27MM X 9.5MM
|
- | Top Mount | Aluminum | 1.063" (27.00mm) | 1.063" (27.00mm) | Thermal Tape, Adhesive (Included) | BGA | 0.374" (9.50mm) | - | 15.50°C/W @ 200 LFM | - | Black Anodized | ||||
Advanced Thermal Solutions Inc. |
104
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK 29MM X 29MM X 9.5MM
|
- | Top Mount | Aluminum | 1.142" (29.01mm) | 1.142" (29.01mm) | Thermal Tape, Adhesive (Included) | BGA | 0.374" (9.50mm) | - | 14.50°C/W @ 200 LFM | - | Black Anodized | ||||
Advanced Thermal Solutions Inc. |
1,239
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK 30MM X 30MM X 9.5MM
|
- | Top Mount | Aluminum | 1.181" (30.00mm) | 1.181" (30.00mm) | Thermal Tape, Adhesive (Included) | BGA | 0.374" (9.50mm) | - | 14.00°C/W @ 200 LFM | - | Black Anodized | ||||
Wakefield-Vette |
155
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 31X31X23MM PIN
|
906 | Top Mount | Aluminum | 1.220" (30.99mm) | 1.220" (30.99mm) | Clip | BGA | 0.892" (22.65mm) | - | 2.40°C/W @ 200 LFM | 9.90°C/W | Black Anodized | ||||
Advanced Thermal Solutions Inc. |
397
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK 32.5 X 32.5 X 9.5MM
|
- | Top Mount | Aluminum | 1.280" (32.51mm) | 1.280" (32.51mm) | Thermal Tape, Adhesive (Included) | BGA | 0.374" (9.50mm) | - | 12.50°C/W @ 200 LFM | - | Black Anodized | ||||
Advanced Thermal Solutions Inc. |
183
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK 35MM X 35MM X 9.5MM
|
- | Top Mount | Aluminum | 1.378" (35.00mm) | 1.378" (35.00mm) | Thermal Tape, Adhesive (Included) | BGA | 0.374" (9.50mm) | - | 11.30°C/W @ 200 LFM | - | Black Anodized | ||||
Advanced Thermal Solutions Inc. |
202
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK 45MM X 45MM X 9.5MM
|
- | Top Mount | Aluminum | 1.772" (45.00mm) | 1.772" (45.00mm) | Thermal Tape, Adhesive (Included) | BGA | 0.374" (9.50mm) | - | 9.20°C/W @ 200 LFM | - | Black Anodized | ||||
Advanced Thermal Solutions Inc. |
146
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK 27MM X 27MM X 19.5MM
|
- | Top Mount | Aluminum | 1.063" (27.00mm) | 1.063" (27.00mm) | Thermal Tape, Adhesive (Included) | BGA | 0.768" (19.50mm) | - | 5.80°C/W @ 200 LFM | - | Black Anodized | ||||
Advanced Thermal Solutions Inc. |
170
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK 25MM X 25MM X 24.5MM
|
- | Top Mount | Aluminum | 0.984" (25.00mm) | 0.984" (25.00mm) | Thermal Tape, Adhesive (Included) | BGA | 0.964" (24.50mm) | - | 4.70°C/W @ 200 LFM | - | Black Anodized | ||||
Advanced Thermal Solutions Inc. |
149
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK 37.5 X 37.5 X 24.5MM
|
- | Top Mount | Aluminum | 1.476" (37.50mm) | 1.476" (37.50mm) | Thermal Tape, Adhesive (Included) | BGA | 0.964" (24.50mm) | - | 3.00°C/W @ 200 LFM | - | Black Anodized | ||||
Advanced Thermal Solutions Inc. |
119
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
MAXIGRIP FANSINK 35X35X9.5MM
|
fanSINK, maxiGRIP | Top Mount | Aluminum | 1.378" (35.00mm) | 1.378" (35.00mm) | Clip, Thermal Material | BGA | 0.374" (9.50mm) | - | 2.60°C/W @ 200 LFM | - | Black Anodized | ||||
Advanced Thermal Solutions Inc. |
113
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
MAXIGRIP FANSINK 27X27X14.5MM
|
fanSINK, maxiGRIP | Top Mount | Aluminum | 1.063" (27.00mm) | 1.063" (27.00mm) | Clip, Thermal Material | BGA | 0.571" (14.50mm) | - | 2.40°C/W @ 200 LFM | - | Black Anodized | ||||
Advanced Thermal Solutions Inc. |
241
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
MAXIGRIP FANSINK 42.5X42.5X9.5MM
|
fanSINK, maxiGRIP | Top Mount | Aluminum | 1.673" (42.49mm) | 1.673" (42.49mm) | Clip, Thermal Material | BGA | 0.374" (9.50mm) | - | 2.30°C/W @ 200 LFM | - | Black Anodized | ||||
Advanced Thermal Solutions Inc. |
263
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
MAXIGRIP FANSINK 42.5X14.5MM
|
fanSINK, maxiGRIP | Top Mount | Aluminum | 1.673" (42.49mm) | 1.673" (42.49mm) | Clip, Thermal Material | BGA | 0.571" (14.50mm) | - | 1.60°C/W @ 200 LFM | - | Black Anodized | ||||
Advanced Thermal Solutions Inc. |
141
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
MAXIGRIP FANSINK 40X40X9.5MM
|
fanSINK, maxiGRIP | Top Mount | Aluminum | 1.575" (40.01mm) | 1.575" (40.01mm) | Clip, Thermal Material | BGA | 0.374" (9.50mm) | - | 2.40°C/W @ 200 LFM | - | Black Anodized | ||||
Advanced Thermal Solutions Inc. |
988
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK 35MM X 35MM X 14.5MM
|
- | Top Mount | Aluminum | 1.378" (35.00mm) | 1.378" (35.00mm) | Thermal Tape, Adhesive (Included) | BGA | 0.571" (14.50mm) | - | 5.90°C/W @ 200 LFM | - | Black Anodized | ||||
Advanced Thermal Solutions Inc. |
4,314
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK 29MM X 29MM X 19.5MM
|
- | Top Mount | Aluminum | 1.142" (29.01mm) | 1.142" (29.01mm) | Thermal Tape, Adhesive (Included) | BGA | 0.768" (19.50mm) | - | 5.50°C/W @ 200 LFM | - | Black Anodized | ||||
Advanced Thermal Solutions Inc. |
639
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK 32.5 X 32.5 X 19.5MM
|
- | Top Mount | Aluminum | 1.280" (32.51mm) | 1.280" (32.51mm) | Thermal Tape, Adhesive (Included) | BGA | 0.768" (19.50mm) | - | 4.60°C/W @ 200 LFM | - | Black Anodized | ||||
Aavid, Thermal Division of Boyd Corporation |
201
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
BOARD LEVEL HEAT SINK
|
- | Board Level | Aluminum | 1.810" (45.97mm) | 1.810" (45.97mm) | Bolt On | TO-3 | 0.750" (19.05mm) | 4.0W @ 30°C | 2.50°C/W @ 400 LFM | 6.20°C/W | Black Anodized |