Xilinx Inc.

XCV812E-6FG900C

Descripción :
IC FPGA 556 I/O 900FBGA
Paquete :
900-FBGA (31x31)
Mounting Type :
Surface Mount
Number of Gates :
254016
Number of I/O :
556
Number of LABs/CLBs :
4704
Number of Logic Elements/Cells :
21168
Operating Temperature :
0°C ~ 85°C (TJ)
Package / Case :
900-BBGA
Series :
Virtex-E EM
Supplier Device Package :
900-FBGA (31x31)
Total RAM Bits :
1146880
Voltage - Supply :
1.71 V ~ 1.89 V

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