Xilinx Inc.

XCKU3P-2FFVD900I

Descripción :
XCKU3P-2FFVD900I
Paquete :
900-FCBGA (31x31)
Mounting Type :
Surface Mount
Number of Gates :
-
Number of I/O :
304
Number of LABs/CLBs :
20340
Number of Logic Elements/Cells :
355950
Operating Temperature :
-40°C ~ 100°C (TJ)
Package / Case :
900-BBGA,FCBGA
Series :
Kintex UltraScale+
Supplier Device Package :
900-FCBGA (31x31)
Total RAM Bits :
31641600
Voltage - Supply :
0.825 V ~ 0.876 V

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