THINC23-21.5-11.4-5.8-0.8

Descripción :
THERMAL PAD COVER 0.8MM
Adhesive :
-
Backing,Carrier :
-
Color :
Gray
Material :
Silicone
Outline :
21.50mm x 11.40mm x 5.80mm
Series :
THINC
Shape :
Rectangle
Thermal Conductivity :
1.9 W/m-K
Thermal Resistivity :
-
Thickness :
0.0315" (0.800mm)
Usage :
-

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