PH3N-101.6-25.4-0.07-1A

Attachment Method :

Adhesive

Diameter :

-

Height Off Base (Height of Fin) :

0.003" (0.07mm)

Length :

4.000" (101.60mm)

Material :

Copper

Material Finish :

Polyester

Package Cooled :

Assorted (BGA, LGA, CPU, ASIC...)

Power Dissipation @ Temperature Rise :

-

Series :

PH3n

Shape :

Rectangular

Thermal Resistance @ Forced Air Flow :

-

Thermal Resistance @ Natural :

-

Type :

Heat Spreader

Width :

1.000" (25.40mm)