t-Global Technology

DC0021/01-TI900-0.12

Descripción :
THERM PAD POWER MOD 0.12MM
Adhesive :
-
Backing,Carrier :
Viscose
Color :
White
Material :
Silicone
Outline :
104.10mm x 73.70mm
Series :
Ti900
Shape :
Rectangle
Thermal Conductivity :
1.8 W/m-K
Thermal Resistivity :
-
Thickness :
0.0050" (0.127mm)
Usage :
Power Module

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