NXP USA Inc.

LPC1830FBD144,551

Descripción :
IC MCU 32BIT ROMLESS 144LQFP
Paquete :
144-LQFP (20x20)
Connectivity :
CANbus,EBI/EMI,Ethernet,I2C,IrDA,Microwire,SD,SPI,SSI,SSP,UART/USART,USB,USB OTG
Core Processor :
ARM Cortex-M3
Core Size :
32-Bit
Data Converters :
A/D 8x10b; D/A 1x10b
EEPROM Size :
-
Number of I/O :
83
Operating Temperature :
-40°C ~ 85°C (TA)
Oscillator Type :
Internal
Package / Case :
144-LQFP
Packaging :
Tray
Peripherals :
Brown-out Detect/Reset,DMA,I2S,POR,PWM,WDT
Program Memory Size :
-
Program Memory Type :
ROMless
RAM Size :
200K x 8
Series :
LPC18xx
Speed :
180MHz
Supplier Device Package :
144-LQFP (20x20)
Voltage - Supply (Vcc/Vdd) :
2.2 V ~ 3.6 V

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