0C97055902

Descripción :
RFI EMI GROUNDING MATERIAL 25FT
Attachment Method :
Adhesive
Height :
0.070" (1.78mm)
Length :
24.000" (609.60mm)
Material :
Beryllium Copper
Operating Temperature :
121°C
Plating :
Unplated
Plating - Thickness :
-
Series :
Twist
Shape :
-
Type :
Fingerstock
Width :
0.300" (7.62mm)

Productos similares