0C97054017

Descripción :
RFI EMI GROUNDING MATERIAL 25FT
Attachment Method :
Adhesive
Height :
0.110" (2.79mm)
Length :
16.000" (406.40mm)
Material :
Beryllium Copper
Operating Temperature :
121°C
Plating :
Tin
Plating - Thickness :
299.21μin (7.60μm)
Series :
-
Shape :
-
Type :
Fingerstock
Width :
0.280" (7.11mm)

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