EPF8820ABC225-2

Descripción :
IC FPGA
Paquete :
225-BGA (19x19)
Mounting Type :
Surface Mount
Number of Gates :
8000
Number of I/O :
152
Number of LABs/CLBs :
84
Number of Logic Elements/Cells :
672
Operating Temperature :
0°C ~ 70°C (TA)
Package / Case :
225-BGA
Series :
FLEX 8000
Supplier Device Package :
225-BGA (19x19)
Total RAM Bits :
-
Voltage - Supply :
4.75 V ~ 5.25 V

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