EPC2107ENGRT
- Descripción :
- TRANS GAN 3N-CH 100V BUMPED DIE
- Paquete :
- 9-BGA (1.35x1.35)
- Esta parte cumple con RoHS
- Hoja de datos (1)
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- Current - Continuous Drain (Id) @ 25°C :
- 1.7A,500mA
- Drain to Source Voltage (Vdss) :
- 100V
- FET Feature :
- GaNFET (Gallium Nitride)
- FET Type :
- 3 N-Channel (Half Bridge + Synchronous Bootstrap)
- Gate Charge (Qg) (Max) @ Vgs :
- 0.16nC @ 5V,0.044nC @ 5V
- Input Capacitance (Ciss) (Max) @ Vds :
- 16pF @ 50V,7pF @ 50V
- Mounting Type :
- Surface Mount
- Operating Temperature :
- -40°C ~ 150°C (TJ)
- Package / Case :
- 9-VFBGA
- Packaging :
- Tape & Reel (TR)
- Power - Max :
- -
- Rds On (Max) @ Id,Vgs :
- 320 mOhm @ 2A,5V,3.3 Ohm @ 2A,5V
- Series :
- eGaN
- Supplier Device Package :
- 9-BGA (1.35x1.35)
- Vgs(th) (Max) @ Id :
- 2.5V @ 100μA,2.5V @ 20μA