EPC

EPC2107ENGRT

Descripción :
TRANS GAN 3N-CH 100V BUMPED DIE
Paquete :
9-BGA (1.35x1.35)
Current - Continuous Drain (Id) @ 25°C :
1.7A,500mA
Drain to Source Voltage (Vdss) :
100V
FET Feature :
GaNFET (Gallium Nitride)
FET Type :
3 N-Channel (Half Bridge + Synchronous Bootstrap)
Gate Charge (Qg) (Max) @ Vgs :
0.16nC @ 5V,0.044nC @ 5V
Input Capacitance (Ciss) (Max) @ Vds :
16pF @ 50V,7pF @ 50V
Mounting Type :
Surface Mount
Operating Temperature :
-40°C ~ 150°C (TJ)
Package / Case :
9-VFBGA
Packaging :
Tape & Reel (TR)
Power - Max :
-
Rds On (Max) @ Id,Vgs :
320 mOhm @ 2A,5V,3.3 Ohm @ 2A,5V
Series :
eGaN
Supplier Device Package :
9-BGA (1.35x1.35)
Vgs(th) (Max) @ Id :
2.5V @ 100μA,2.5V @ 20μA

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