EPC2106

Descripción :
TRANS GAN SYM 100V BUMPED DIE
Paquete :
Die
Current - Continuous Drain (Id) @ 25°C :
1.7A
Drain to Source Voltage (Vdss) :
100V
FET Feature :
GaNFET (Gallium Nitride)
FET Type :
2 N-Channel (Half Bridge)
Gate Charge (Qg) (Max) @ Vgs :
0.73nC @ 5V
Input Capacitance (Ciss) (Max) @ Vds :
75pF @ 50V
Mounting Type :
Surface Mount
Operating Temperature :
-40°C ~ 150°C (TJ)
Package / Case :
Die
Packaging :
Tape & Reel (TR)
Power - Max :
-
Rds On (Max) @ Id,Vgs :
70 mOhm @ 2A,5V
Series :
eGaN
Supplier Device Package :
Die
Vgs(th) (Max) @ Id :
2.5V @ 600μA

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