HSP-3

Descripción :
THERMAL PAD TRIPLE PHASE
Adhesive :
-
Backing,Carrier :
-
Color :
White
Material :
-
Outline :
104.39mm x 73.66mm
Series :
HSP
Shape :
Rectangle
Thermal Conductivity :
1.0 W/m-K
Thermal Resistivity :
-
Thickness :
0.0039" (0.100mm)
Usage :
Three Phase SSRs

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