Bergquist

CPU .63X.63

Descripción :
THERMAL PAD CPU .63"X.63"
Adhesive :
-
Backing,Carrier :
-
Color :
Tan
Material :
-
Outline :
16.00mm x 16.00mm
Series :
CPU Pad
Shape :
Square
Thermal Conductivity :
0.6 W/m-K
Thermal Resistivity :
-
Thickness :
0.0050" (0.127mm)
Usage :
CPU

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