36-3571-10

Descripción :
CONN IC DIP SOCKET ZIF 36POS TIN
Contact Finish - Mating :
Tin
Contact Finish - Post :
Tin
Contact Finish Thickness - Mating :
200μin (5.08μm)
Contact Finish Thickness - Post :
200μin (5.08μm)
Contact Material - Mating :
Beryllium Copper
Contact Material - Post :
Beryllium Copper
Features :
Closed Frame
Housing Material :
Polyphenylene Sulfide (PPS),Glass Filled
Mounting Type :
Through Hole
Number of Positions or Pins (Grid) :
36 (2 x 18)
Operating Temperature :
-
Packaging :
Bulk
Pitch - Mating :
0.100" (2.54mm)
Pitch - Post :
0.100" (2.54mm)
Series :
57
Termination :
Solder
Type :
DIP,ZIF (ZIP),0.3" (7.62mm) Row Spacing
倍数 :
1

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