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32-6554-10
- Descripción :
- CONN IC DIP SOCKET ZIF 32POS TIN
- Esta parte cumple con RoHS
- Hoja de datos (1)
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- Contact Finish - Mating :
- Tin
- Contact Finish - Post :
- Tin
- Contact Finish Thickness - Mating :
- 200μin (5.08μm)
- Contact Finish Thickness - Post :
- 200μin (5.08μm)
- Contact Material - Mating :
- Beryllium Copper
- Contact Material - Post :
- Beryllium Copper
- Features :
- Closed Frame
- Housing Material :
- Polyphenylene Sulfide (PPS)，Glass Filled
- Mounting Type :
- Through Hole
- Number of Positions or Pins (Grid) :
- 32 (2 x 16)
- Operating Temperature :
- -
- Packaging :
- Bulk
- Pitch - Mating :
- 0.100" (2.54mm)
- Pitch - Post :
- 0.100" (2.54mm)
- Series :
- 55
- Termination :
- Solder
- Type :
- DIP，ZIF (ZIP)，0.6" (15.24mm) Row Spacing
- 倍数 :
- 1
