30-6501-20

Descripción :
CONN IC DIP SOCKET 30POS TIN
Contact Finish - Mating :
Tin
Contact Finish - Post :
Tin
Contact Finish Thickness - Mating :
200μin (5.08μm)
Contact Finish Thickness - Post :
200μin (5.08μm)
Contact Material - Mating :
Phosphor Bronze
Contact Material - Post :
Phosphor Bronze
Features :
Closed Frame
Housing Material :
Polyamide (PA46),Nylon 4/6,Glass Filled
Mounting Type :
Through Hole
Number of Positions or Pins (Grid) :
30 (2 x 15)
Operating Temperature :
-55°C ~ 105°C
Packaging :
Bulk
Pitch - Mating :
0.100" (2.54mm)
Pitch - Post :
0.100" (2.54mm)
Series :
501
Termination :
Wire Wrap
Type :
DIP,0.6" (15.24mm) Row Spacing
倍数 :
1

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