533201B02500G

Descripción :
BOARD LEVEL HEAT SINK
Attachment Method :
Bolt On and PC Pin
Diameter :
-
Height Off Base (Height of Fin) :
0.500" (12.70mm)
Length :
2.000" (50.80mm)
Material :
Aluminum
Material Finish :
Black Anodized
Package Cooled :
TO-218, TO-247
Power Dissipation @ Temperature Rise :
3.0W @ 30°C
Series :
-
Shape :
Rectangular, Fins
Thermal Resistance @ Forced Air Flow :
3.00°C/W @ 400 LFM
Thermal Resistance @ Natural :
9.00°C/W
Type :
Board Level, Vertical
Width :
1.375" (34.93mm)

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