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La imagen Número de pieza Fabricante Cantidad Plazo de entrega Precio unitario Comprar Descripción Series Operating Temperature Type Material Shape Height Length Width Plating Plating - Thickness Attachment Method
331171302035
Wurth Electronics Inc.
1,944
3 dias
-
MOQ: 1  MPQ: 1
CONTACT FINGER EMI SMD
WE-SECF -40°C ~ 100°C Shield Finger Beryllium Copper - 0.138" (3.50mm) 0.118" (3.00mm) 0.079" (2.00mm) Gold Flash Solder
331171302035
Wurth Electronics Inc.
1,944
3 dias
-
MOQ: 1  MPQ: 1
CONTACT FINGER EMI SMD
WE-SECF -40°C ~ 100°C Shield Finger Beryllium Copper - 0.138" (3.50mm) 0.118" (3.00mm) 0.079" (2.00mm) Gold Flash Solder
77001902
Laird Technologies EMI
2,055
3 dias
-
MOQ: 1  MPQ: 1
GASKET BECU 8.1X18.54MM
Slot Mount 121°C Fingerstock Beryllium Copper - 0.110" (2.79mm) 0.730" (18.54mm) 0.320" (8.13mm) - - Slot
SMG236354R-0.315
Leader Tech Inc.
600
3 dias
-
MOQ: 1  MPQ: 1
SURFACE MOUNT GASKET
- - Film Over Foam Polyurethane Foam,Tin-Copper Polyester (SN/CU) Rectangle 0.236" (6.00mm) 0.315" (8.00mm) 0.354" (9.00mm) - - -
SMG236354R-0.315
Leader Tech Inc.
1,173
3 dias
-
MOQ: 1  MPQ: 1
SURFACE MOUNT GASKET
- - Film Over Foam Polyurethane Foam,Tin-Copper Polyester (SN/CU) Rectangle 0.236" (6.00mm) 0.315" (8.00mm) 0.354" (9.00mm) - - -
SMG236354R-0.315
Leader Tech Inc.
1,173
3 dias
-
MOQ: 1  MPQ: 1
SURFACE MOUNT GASKET
- - Film Over Foam Polyurethane Foam,Tin-Copper Polyester (SN/CU) Rectangle 0.236" (6.00mm) 0.315" (8.00mm) 0.354" (9.00mm) - - -
67BCG2004005508R00
Laird Technologies EMI
Consulta
-
-
MOQ: 1  MPQ: 1
SMD CONTACT 2.0X4.0X5.5
- - - - - - 0.157" (4.00mm) 0.078" (2mm) - - -
67BCG2004005508R00
Laird Technologies EMI
1,044
3 dias
-
MOQ: 1  MPQ: 1
SMD CONTACT 2.0X4.0X5.5
- - - - - - 0.157" (4.00mm) 0.078" (2mm) - - -
67BCG2004005508R00
Laird Technologies EMI
Consulta
-
-
MOQ: 1  MPQ: 1
SMD CONTACT 2.0X4.0X5.5
- - - - - - 0.157" (4.00mm) 0.078" (2mm) - - -
331011452535
Wurth Electronics Inc.
Consulta
-
-
MOQ: 1  MPQ: 1
WE-SECF SMD EMI CONTACT FINGER
WE-SECF -40°C ~ 100°C Shield Finger Beryllium Copper - 0.138" (3.50mm) 0.177" (4.50mm) 0.098" (2.50mm) Gold Flash Solder
331011452535
Wurth Electronics Inc.
1,916
3 dias
-
MOQ: 1  MPQ: 1
WE-SECF SMD EMI CONTACT FINGER
WE-SECF -40°C ~ 100°C Shield Finger Beryllium Copper - 0.138" (3.50mm) 0.177" (4.50mm) 0.098" (2.50mm) Gold Flash Solder
331011452535
Wurth Electronics Inc.
1,916
3 dias
-
MOQ: 1  MPQ: 1
WE-SECF SMD EMI CONTACT FINGER
WE-SECF -40°C ~ 100°C Shield Finger Beryllium Copper - 0.138" (3.50mm) 0.177" (4.50mm) 0.098" (2.50mm) Gold Flash Solder
BMI-C-004
Laird Technologies EMI
Consulta
-
-
MOQ: 1  MPQ: 1
CONTACT BECU 6.0X4.3MM
- - Shield Finger - - - 0.235" (5.97mm) 0.235" (5.97mm) - - -
BMI-C-004
Laird Technologies EMI
1,511
3 dias
-
MOQ: 1  MPQ: 1
CONTACT BECU 6.0X4.3MM
- - Shield Finger - - - 0.235" (5.97mm) 0.235" (5.97mm) - - -
BMI-C-004
Laird Technologies EMI
1,511
3 dias
-
MOQ: 1  MPQ: 1
CONTACT BECU 6.0X4.3MM
- - Shield Finger - - - 0.235" (5.97mm) 0.235" (5.97mm) - - -
331161452070
Wurth Electronics Inc.
1,000
3 dias
-
MOQ: 1  MPQ: 1
CONTACT FINGER EMI SMD
WE-SECF -40°C ~ 100°C Shield Finger Beryllium Copper - 0.276" (7.00mm) 0.177" (4.50mm) 0.079" (2.00mm) Gold Flash Solder
331161452070
Wurth Electronics Inc.
1,365
3 dias
-
MOQ: 1  MPQ: 1
CONTACT FINGER EMI SMD
WE-SECF -40°C ~ 100°C Shield Finger Beryllium Copper - 0.276" (7.00mm) 0.177" (4.50mm) 0.079" (2.00mm) Gold Flash Solder
331161452070
Wurth Electronics Inc.
1,365
3 dias
-
MOQ: 1  MPQ: 1
CONTACT FINGER EMI SMD
WE-SECF -40°C ~ 100°C Shield Finger Beryllium Copper - 0.276" (7.00mm) 0.177" (4.50mm) 0.079" (2.00mm) Gold Flash Solder
BMI-C-002
Laird Technologies EMI
Consulta
-
-
MOQ: 1  MPQ: 1
CONTACT RETAINER FOR BOARDSHIELD
- - Shield Clip Beryllium Copper - 0.100" (2.54mm) 0.374" (9.50mm) 0.090" (2.28mm) Gold - Solder
BMI-C-002
Laird Technologies EMI
3,499
3 dias
-
MOQ: 1  MPQ: 1
CONTACT RETAINER FOR BOARDSHIELD
- - Shield Clip Beryllium Copper - 0.100" (2.54mm) 0.374" (9.50mm) 0.090" (2.28mm) Gold - Solder