- Series:
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- Operating Temperature:
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- Type:
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- Material:
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- Shape:
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- Height:
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- Length:
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Descubre los productos 3,471
La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Operating Temperature | Type | Material | Shape | Height | Length | Width | Plating | Plating - Thickness | Attachment Method | ||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Operating Temperature | Type | Material | Shape | Height | Length | Width | Plating | Plating - Thickness | Attachment Method | ||
Wurth Electronics Inc. |
1,944
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
CONTACT FINGER EMI SMD
|
WE-SECF | -40°C ~ 100°C | Shield Finger | Beryllium Copper | - | 0.138" (3.50mm) | 0.118" (3.00mm) | 0.079" (2.00mm) | Gold | Flash | Solder | ||||
Wurth Electronics Inc. |
1,944
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
CONTACT FINGER EMI SMD
|
WE-SECF | -40°C ~ 100°C | Shield Finger | Beryllium Copper | - | 0.138" (3.50mm) | 0.118" (3.00mm) | 0.079" (2.00mm) | Gold | Flash | Solder | ||||
Laird Technologies EMI |
2,055
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
GASKET BECU 8.1X18.54MM
|
Slot Mount | 121°C | Fingerstock | Beryllium Copper | - | 0.110" (2.79mm) | 0.730" (18.54mm) | 0.320" (8.13mm) | - | - | Slot | ||||
Leader Tech Inc. |
600
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
SURFACE MOUNT GASKET
|
- | - | Film Over Foam | Polyurethane Foam,Tin-Copper Polyester (SN/CU) | Rectangle | 0.236" (6.00mm) | 0.315" (8.00mm) | 0.354" (9.00mm) | - | - | - | ||||
Leader Tech Inc. |
1,173
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
SURFACE MOUNT GASKET
|
- | - | Film Over Foam | Polyurethane Foam,Tin-Copper Polyester (SN/CU) | Rectangle | 0.236" (6.00mm) | 0.315" (8.00mm) | 0.354" (9.00mm) | - | - | - | ||||
Leader Tech Inc. |
1,173
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
SURFACE MOUNT GASKET
|
- | - | Film Over Foam | Polyurethane Foam,Tin-Copper Polyester (SN/CU) | Rectangle | 0.236" (6.00mm) | 0.315" (8.00mm) | 0.354" (9.00mm) | - | - | - | ||||
Laird Technologies EMI |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
SMD CONTACT 2.0X4.0X5.5
|
- | - | - | - | - | - | 0.157" (4.00mm) | 0.078" (2mm) | - | - | - | ||||
Laird Technologies EMI |
1,044
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
SMD CONTACT 2.0X4.0X5.5
|
- | - | - | - | - | - | 0.157" (4.00mm) | 0.078" (2mm) | - | - | - | ||||
Laird Technologies EMI |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
SMD CONTACT 2.0X4.0X5.5
|
- | - | - | - | - | - | 0.157" (4.00mm) | 0.078" (2mm) | - | - | - | ||||
Wurth Electronics Inc. |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
WE-SECF SMD EMI CONTACT FINGER
|
WE-SECF | -40°C ~ 100°C | Shield Finger | Beryllium Copper | - | 0.138" (3.50mm) | 0.177" (4.50mm) | 0.098" (2.50mm) | Gold | Flash | Solder | ||||
Wurth Electronics Inc. |
1,916
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
WE-SECF SMD EMI CONTACT FINGER
|
WE-SECF | -40°C ~ 100°C | Shield Finger | Beryllium Copper | - | 0.138" (3.50mm) | 0.177" (4.50mm) | 0.098" (2.50mm) | Gold | Flash | Solder | ||||
Wurth Electronics Inc. |
1,916
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
WE-SECF SMD EMI CONTACT FINGER
|
WE-SECF | -40°C ~ 100°C | Shield Finger | Beryllium Copper | - | 0.138" (3.50mm) | 0.177" (4.50mm) | 0.098" (2.50mm) | Gold | Flash | Solder | ||||
Laird Technologies EMI |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONTACT BECU 6.0X4.3MM
|
- | - | Shield Finger | - | - | - | 0.235" (5.97mm) | 0.235" (5.97mm) | - | - | - | ||||
Laird Technologies EMI |
1,511
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
CONTACT BECU 6.0X4.3MM
|
- | - | Shield Finger | - | - | - | 0.235" (5.97mm) | 0.235" (5.97mm) | - | - | - | ||||
Laird Technologies EMI |
1,511
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
CONTACT BECU 6.0X4.3MM
|
- | - | Shield Finger | - | - | - | 0.235" (5.97mm) | 0.235" (5.97mm) | - | - | - | ||||
Wurth Electronics Inc. |
1,000
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
CONTACT FINGER EMI SMD
|
WE-SECF | -40°C ~ 100°C | Shield Finger | Beryllium Copper | - | 0.276" (7.00mm) | 0.177" (4.50mm) | 0.079" (2.00mm) | Gold | Flash | Solder | ||||
Wurth Electronics Inc. |
1,365
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
CONTACT FINGER EMI SMD
|
WE-SECF | -40°C ~ 100°C | Shield Finger | Beryllium Copper | - | 0.276" (7.00mm) | 0.177" (4.50mm) | 0.079" (2.00mm) | Gold | Flash | Solder | ||||
Wurth Electronics Inc. |
1,365
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
CONTACT FINGER EMI SMD
|
WE-SECF | -40°C ~ 100°C | Shield Finger | Beryllium Copper | - | 0.276" (7.00mm) | 0.177" (4.50mm) | 0.079" (2.00mm) | Gold | Flash | Solder | ||||
Laird Technologies EMI |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONTACT RETAINER FOR BOARDSHIELD
|
- | - | Shield Clip | Beryllium Copper | - | 0.100" (2.54mm) | 0.374" (9.50mm) | 0.090" (2.28mm) | Gold | - | Solder | ||||
Laird Technologies EMI |
3,499
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
CONTACT RETAINER FOR BOARDSHIELD
|
- | - | Shield Clip | Beryllium Copper | - | 0.100" (2.54mm) | 0.374" (9.50mm) | 0.090" (2.28mm) | Gold | - | Solder |