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- Operating Temperature:
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- Condiciones seleccionadas:
Descubre los productos 332
La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Operating Temperature | Type | Material | Shape | Height | Length | Width | Plating - Thickness | Attachment Method | ||
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Operating Temperature | Type | Material | Shape | Height | Length | Width | Plating - Thickness | Attachment Method | ||
Leader Tech Inc. |
Consulta
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- |
-
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MOQ: 1 MPQ: 1
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0.14 X 0.37 SN 16--FOLDED SERIES
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- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | - | 0.140" (3.56mm) | 16.000" (406.40mm) | 0.370" (9.40mm) | Flash | Adhesive | ||||
Leader Tech Inc. |
Consulta
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- |
-
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MOQ: 1 MPQ: 1
|
0.11 X 0.354 SN 15--11-S-35DTS-S
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- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | - | 0.110" (2.79mm) | 15.000" (381.00mm) | 0.350" (8.89mm) | Flash | Adhesive | ||||
Leader Tech Inc. |
Consulta
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- |
-
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MOQ: 1 MPQ: 1
|
0.07 X 0.34 SN 24--6-S-34T-SN-24
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- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | - | 0.060" (1.52mm) | 24.000" (609.60mm) | 0.340" (8.64mm) | Flash | Adhesive | ||||
Leader Tech Inc. |
Consulta
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- |
-
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MOQ: 1 MPQ: 1
|
.156" DIA ROUND ALL MESH--7000-9
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- | - | Gasket | - | Round | - | - | 0.156" (3.96mm) | - | - | ||||
Laird Technologies EMI |
Consulta
|
- |
-
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MOQ: 1 MPQ: 1
|
S3,STR,SNSAT,USFT,RIV
|
- | 121°C | Fingerstock | Beryllium Copper | - | 0.110" (2.79mm) | 15.000" (381.00mm) | 0.350" (8.89mm) | 299.21μin (7.60μm) | Adhesive | ||||
Leader Tech Inc. |
Consulta
|
- |
-
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MOQ: 1 MPQ: 1
|
0.11 X 0.375 SN 16--FOLDED SERIE
|
- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | - | 0.110" (2.79mm) | 16.000" (406.40mm) | 0.370" (9.40mm) | Flash | Adhesive | ||||
Leader Tech Inc. |
Consulta
|
- |
-
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MOQ: 1 MPQ: 1
|
0.06 X 0.50 SN 24--TWIST DOUBLE
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- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | - | 0.060" (1.52mm) | 24.000" (609.60mm) | 0.500" (12.70mm) | Flash | Adhesive | ||||
Leader Tech Inc. |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.14 X 0.36 SN 16--FOLDED SERIES
|
- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | - | 0.140" (3.56mm) | 16.000" (406.40mm) | 0.370" (9.40mm) | Flash | Adhesive | ||||
Leader Tech Inc. |
Consulta
|
- |
-
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MOQ: 1 MPQ: 1
|
0.22 X 0.60 SN 15--22-62DT-SN-15
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- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | - | 0.220" (5.59mm) | 15.000" (381.00mm) | 0.620" (15.75mm) | Flash | Adhesive | ||||
Leader Tech Inc. |
Consulta
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- |
-
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MOQ: 1 MPQ: 1
|
.375"X1.00" DOUBLE ROUND / ADH--
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- | - | Gasket | - | Round | - | - | 1.000" (25.40mm) | - | - | ||||
Leader Tech Inc. |
Consulta
|
- |
-
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MOQ: 1 MPQ: 1
|
.093" DIA ROUND ALL MESH--7000-0
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- | - | Gasket | - | Round | - | - | 0.093" (2.36mm) | - | - | ||||
Leader Tech Inc. |
Consulta
|
- |
-
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MOQ: 1 MPQ: 1
|
.312" X .875" ROUND WITH FIN--71
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- | - | Gasket | - | Round | - | - | 0.875" (22.23mm) | - | - | ||||
Leader Tech Inc. |
Consulta
|
- |
-
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MOQ: 1 MPQ: 1
|
0.14 X 0.51 SN 16.0--FOLDED SERI
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- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | - | 0.140" (3.56mm) | 16.000" (406.40mm) | 0.510" (12.95mm) | Flash | Adhesive | ||||
Leader Tech Inc. |
Consulta
|
- |
-
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MOQ: 1 MPQ: 1
|
0.11 X 0.35 SN 15 NTP--11-35DT-S
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- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | - | 0.110" (2.79mm) | 15.000" (381.00mm) | 0.350" (8.89mm) | Flash | Adhesive | ||||
Leader Tech Inc. |
Consulta
|
- |
-
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MOQ: 1 MPQ: 1
|
0.13 X 0.37 SN 16.0--13-37AH-SN-
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- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | - | 0.130" (3.30mm) | 16.000" (406.40mm) | 0.370" (9.40mm) | Flash | Adhesive | ||||
Laird Technologies EMI |
Consulta
|
- |
-
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MOQ: 1 MPQ: 1
|
S3,STR,SNB,USFT,RIVIT
|
- | 121°C | Fingerstock | Beryllium Copper | - | 0.140" (3.56mm) | 15.000" (381.00mm) | 0.450" (11.43mm) | 299.21μin (7.60μm) | Adhesive | ||||
Laird Technologies EMI |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
S3,STR,NIB,USFT,RIV
|
- | 121°C | Fingerstock | Beryllium Copper | - | 0.140" (3.56mm) | 15.000" (381.00mm) | 0.450" (11.43mm) | 299.21μin (7.60μm) | Adhesive | ||||
Laird Technologies EMI |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
AP,STR,SNB,USFT,PSA
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- | 121°C | Fingerstock | Beryllium Copper | - | 0.410" (10.41mm) | 12.000" (304.80mm) | 1.130" (28.70mm) | 299.21μin (7.60μm) | Adhesive | ||||
Laird Technologies EMI |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
S3,STR,SNB,USFT,RIV
|
- | 121°C | Fingerstock | Beryllium Copper | - | 0.220" (5.59mm) | 15.000" (381.00mm) | 0.620" (15.75mm) | 299.21μin (7.60μm) | Rivet | ||||
Leader Tech Inc. |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.11 X 0.32 SN 17.76--11-32AH-SN
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- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | - | 0.110" (2.79mm) | 17.760" (451.10mm) | 0.320" (8.13mm) | Flash | Adhesive |