- Length:
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- Plating:
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- Attachment Method:
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- Condiciones seleccionadas:
Descubre los productos 3
La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Height | Length | Width | Plating | Attachment Method | ||
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Height | Length | Width | Plating | Attachment Method | ||
Laird Technologies EMI |
Consulta
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- |
-
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MOQ: 1 MPQ: 1
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RFI EMI GROUNDING MATERIAL 25FT
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0.250" (6.35mm) | 25.000 (7.62m) | 1.090" (27.69mm) | - | Hardware,Rivet,Solder | ||||
Laird Technologies EMI |
Consulta
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- |
-
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MOQ: 1 MPQ: 1
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CSTR COIL BF USF
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0.250" (6.35mm) | 25.000 (7.60m) | 1.090" (27.69mm) | Unplated | Adhesive | ||||
Laird Technologies EMI |
Consulta
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- |
-
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MOQ: 1 MPQ: 1
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CSTR COIL BF USF
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0.410" (10.41mm) | 25.000 (7.62m) | 1.630" (41.40mm) | Unplated | Adhesive |