- Plating - Thickness：
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- Attachment Method：
-
- Condiciones seleccionadas:
Descubre los productos 5
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Height | Width | Plating | Plating - Thickness | Attachment Method | |
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Height | Width | Plating | Plating - Thickness | Attachment Method | |
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Laird Technologies EMI |
Consulta
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-
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MOQ: 1 MPQ: 1
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RFI EMI GROUNDING MATERIAL 25FT
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0.250" (6.35mm) | 1.090" (27.69mm) | - | - | Hardware，Rivet，Solder | ||
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Laird Technologies EMI |
Consulta
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- |
-
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MOQ: 1 MPQ: 1
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CSTR COIL SNB
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0.410" (10.41mm) | 1.630" (41.40mm) | Tin | 299.21μin (7.60μm) | Hardware，Rivet，Solder | ||
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Laird Technologies EMI |
Consulta
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- |
-
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MOQ: 1 MPQ: 1
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CSTR COIL NIE
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0.410" (10.41mm) | 1.630" (41.40mm) | Nickel | 299.21μin (7.60μm) | Hardware，Rivet，Solder | |||
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Laird Technologies EMI |
Consulta
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- |
-
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MOQ: 1 MPQ: 1
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CSTR COIL BF USF
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0.410" (10.41mm) | 1.630" (41.40mm) | Unplated | - | Adhesive | |||
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Laird Technologies EMI |
Consulta
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- |
-
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MOQ: 1 MPQ: 1
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CSTR COIL ZNY
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0.250" (6.35mm) | 1.090" (27.69mm) | Zinc + Yellow Chromate | 299.21μin (7.60μm) | Hardware，Rivet，Solder |
