Descubre los productos 7
La imagen Número de pieza Fabricante Cantidad Plazo de entrega Precio unitario Comprar Descripción Series Operating Temperature Type Material Shape Height Plating Plating - Thickness Attachment Method
5411-0003-60-300
Leader Tech Inc.
2
3 dias
-
MOQ: 1  MPQ: 1
NI/C FILLED SILICONE; 0.25" OD,
- -55°C ~ 160°C Shielding Material Conductive Elastomer Round - - - -
5409-0006-20-300
Leader Tech Inc.
2
3 dias
-
MOQ: 1  MPQ: 1
M83528/009B006,AG/AL FILLED SIL
- -55°C ~ 160°C Shielding Material Conductive Elastomer Rectangle - - - -
5409-0006-40-300
Leader Tech Inc.
5
3 dias
-
MOQ: 1  MPQ: 1
M83528/009D006,AG/AL FILLED FLO
- -55°C ~ 160°C Shielding Material Conductive Elastomer Rectangle - - - -
5411-0003-20-300
Leader Tech Inc.
6
3 dias
-
MOQ: 1  MPQ: 1
M83528/011B003,AG/AL FILLED SIL
- -55°C ~ 160°C Shielding Material Conductive Elastomer Round - - - -
5411-0003-40-300
Leader Tech Inc.
2
3 dias
-
MOQ: 1  MPQ: 1
M83528/011D003,AG/AL FILLED FLO
- -55°C ~ 160°C Shielding Material Conductive Elastomer Round - - - -
5409-0006-60-300
Leader Tech Inc.
1
3 dias
-
MOQ: 1  MPQ: 1
NI/C FILLED SILICONE; 0.25" X .0
- -55°C ~ 160°C Shielding Material Conductive Elastomer Rectangle - - - -
0C97054217
Laird Technologies EMI
Consulta
-
-
MOQ: 1  MPQ: 1
NOSG COIL SNB PSA
Foldover 121°C Fingerstock Beryllium Copper - 0.080" (2.03mm) Tin 299.21μin (7.60μm) Adhesive