- Series：
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- Operating Temperature：
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- Type：
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- Material：
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- Plating：
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- Plating - Thickness：
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- Attachment Method：
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- Condiciones seleccionadas:
Descubre los productos 19
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Operating Temperature | Type | Material | Height | Plating | Plating - Thickness | Attachment Method | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Operating Temperature | Type | Material | Height | Plating | Plating - Thickness | Attachment Method | |
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Laird Technologies EMI |
491
|
3 dias |
-
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MOQ: 1 MPQ: 1
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GASKET BECU ALLOY 6.35X406.4MM
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Foldover | 121°C | Fingerstock | Beryllium Copper | 0.080" (2.03mm) | - | - | Adhesive | ||
|
|
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Laird Technologies EMI |
483
|
3 dias |
-
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MOQ: 1 MPQ: 1
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FINGERSTOCK BECU 6.35X406.4MM
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- | - | - | - | - | - | - | - | ||
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Laird Technologies EMI |
Consulta
|
- |
-
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MOQ: 1 MPQ: 1
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FINGERSTCK ULTRASFT 6.35X406.4MM
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Foldover | 121°C | Fingerstock | Beryllium Copper | 0.080" (2.03mm) | - | - | - | ||
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Leader Tech Inc. |
93
|
3 dias |
-
|
MOQ: 1 MPQ: 1
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COPPER BERYLLIUM FINGERSTOCK EMI
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- | - | Fingerstock | Beryllium Copper | 0.080" (2.03mm) | - | - | - | |||
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Laird Technologies EMI |
Consulta
|
- |
-
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MOQ: 1 MPQ: 1
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NOSG COIL BF PSA
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Foldover | 121°C | Fingerstock | Beryllium Copper | 0.080" (2.03mm) | Unplated | - | Adhesive | ||
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Laird Technologies EMI |
Consulta
|
- |
-
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MOQ: 1 MPQ: 1
|
NOSG,STR,BF
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Foldover | 121°C | Fingerstock | Beryllium Copper | 0.080" (2.03mm) | - | - | Adhesive | ||
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|
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Laird Technologies EMI |
Consulta
|
- |
-
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MOQ: 1 MPQ: 1
|
NOSG,STR,ZNC,PSA
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Foldover | 121°C | Fingerstock | Beryllium Copper | 0.080" (2.03mm) | Zinc + Clear Chromate | 299.21μin (7.60μm) | Adhesive | ||
|
|
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Laird Technologies EMI |
Consulta
|
- |
-
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MOQ: 1 MPQ: 1
|
NOSG,STR,SNB,PSA
|
Foldover | 121°C | Fingerstock | Beryllium Copper | 0.080" (2.03mm) | Tin | 299.21μin (7.60μm) | Adhesive | ||
|
|
|
Laird Technologies EMI |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
NOSG,STR,NIB,PSA
|
Foldover | 121°C | Fingerstock | Beryllium Copper | 0.080" (2.03mm) | Nickel | 299.21μin (7.60μm) | Adhesive | ||
|
|
Laird Technologies EMI |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
NOSG COIL BF USF PSA
|
Foldover | 121°C | Fingerstock | Beryllium Copper | 0.080" (2.03mm) | Unplated | - | Adhesive | |||
|
|
Laird Technologies EMI |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
NOSG COIL ZNY PSA
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Foldover | 121°C | Fingerstock | Beryllium Copper | 0.080" (2.03mm) | Zinc + Yellow Chromate | 299.21μin (7.60μm) | Adhesive | |||
|
|
Laird Technologies EMI |
Consulta
|
- |
-
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MOQ: 1 MPQ: 1
|
NOSG COIL NIB PSA
|
Foldover | 121°C | Fingerstock | Beryllium Copper | 0.080" (2.03mm) | Nickel | 299.21μin (7.60μm) | Adhesive | |||
|
|
Laird Technologies EMI |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
NOSG,STR,SNB,USF,PSA
|
Foldover | 121°C | Fingerstock | Beryllium Copper | 0.080" (2.03mm) | Tin | 299.21μin (7.60μm) | Adhesive | |||
|
|
Laird Technologies EMI |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
NOSG,STR,BF,USFT
|
Foldover | 121°C | Fingerstock | Beryllium Copper | 0.080" (2.03mm) | - | - | - | |||
|
|
Leader Tech Inc. |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.07 X .25 X 045 CDC 16--7-21C-0
|
- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | 0.070" (1.78mm) | Cadmium + Clear Chromate | Flash | Adhesive | |||
|
|
Leader Tech Inc. |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.07 X .25 X 045 BD 16--7-21C-04
|
- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | 0.070" (1.78mm) | Unplated | - | Adhesive | |||
|
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Leader Tech Inc. |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.08 X 0.25 SN 16--FOLDED SERIES
|
- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | 0.080" (2.03mm) | Tin | Flash | Adhesive | |||
|
|
Leader Tech Inc. |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.07 X .25 X 045 SN 16--7-21C-04
|
- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | 0.070" (1.78mm) | Tin | Flash | Adhesive | |||
|
|
Leader Tech Inc. |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.07 X .25 X 045 NI 16--7-21C-04
|
- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | 0.070" (1.78mm) | Nickel | Flash | Adhesive |
