Descubre los productos 104
La imagen Número de pieza Fabricante Cantidad Plazo de entrega Precio unitario Comprar Descripción Series Operating Temperature Type Material Shape Height Length Plating Plating - Thickness Attachment Method
22-60AH-BD-16-NTP
Leader Tech Inc.
Consulta
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MOQ: 1  MPQ: 1
0.22 X 0.60 BD 16 NTP--22-60AH-B
- -55°C ~ 121°C Fingerstock Beryllium Copper - 0.220" (5.59mm) 16.000" (406.40mm) Unplated - Adhesive
22-60RH-NI-16
Leader Tech Inc.
Consulta
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MOQ: 1  MPQ: 1
0.22 X 0.60 NI 16--22-60RH-NI-16
- -55°C ~ 121°C Fingerstock Beryllium Copper - 0.220" (5.59mm) 16.000" (406.40mm) Nickel Flash Adhesive
12-60LPAH-BD-16
Leader Tech Inc.
Consulta
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MOQ: 1  MPQ: 1
0.12 X 0.60 BD 16--12-60LPAH-BD-
- -55°C ~ 121°C Fingerstock Beryllium Copper - 0.120" (3.05mm) 16.000" (406.40mm) Unplated - Adhesive
22-S-60AH-BD-16
Leader Tech Inc.
Consulta
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MOQ: 1  MPQ: 1
0.22 X 0.60 BD 16--22-S-60AH-BD-
- -55°C ~ 121°C Fingerstock Beryllium Copper - 0.220" (5.59mm) 16.000" (406.40mm) Unplated - Adhesive
23-60FS-BD-24
Leader Tech Inc.
Consulta
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MOQ: 1  MPQ: 1
0.23 X 0.60 BD 24--FOLDED SERIES
- -55°C ~ 121°C Fingerstock Beryllium Copper - 0.230" (5.84mm) 24.000" (609.60mm) Unplated - Adhesive
22-60AH-SN-16
Leader Tech Inc.
Consulta
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MOQ: 1  MPQ: 1
0.22 X 0.60 SN 16--22-60AH-SN-16
- -55°C ~ 121°C Fingerstock Beryllium Copper - 0.220" (5.59mm) 16.000" (406.40mm) Tin Flash Adhesive
22-S-60RH-BD-16
Leader Tech Inc.
Consulta
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MOQ: 1  MPQ: 1
0.22 X 0.60 BD 16--22-S-60RH-BD-
- -55°C ~ 121°C Fingerstock Beryllium Copper - 0.220" (5.59mm) 16.000" (406.40mm) Unplated - Adhesive
12-60LPAH-SN-16
Leader Tech Inc.
Consulta
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MOQ: 1  MPQ: 1
0.12 X 0.60 SN 16--12-60LPAH-SN-
- -55°C ~ 121°C Fingerstock Beryllium Copper - 0.120" (3.05mm) 16.000" (406.40mm) Tin Flash Adhesive
22-60AH-NI-16
Leader Tech Inc.
Consulta
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MOQ: 1  MPQ: 1
0.22 X 0.60 NI 16--22-60AH-NI-16
- -55°C ~ 121°C Fingerstock Beryllium Copper - 0.220" (5.59mm) 16.000" (406.40mm) Nickel Flash Adhesive
22-60RH-SN-16
Leader Tech Inc.
Consulta
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MOQ: 1  MPQ: 1
0.22 X 0.60 SN 16--22-60RH-SN-16
- -55°C ~ 121°C Fingerstock Beryllium Copper - 0.220" (5.59mm) 16.000" (406.40mm) Tin Flash Adhesive
23-60FSV50-BD-24
Leader Tech Inc.
Consulta
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MOQ: 1  MPQ: 1
0.23 X 0.60 BD 24--FOLDED SERIES
- -55°C ~ 121°C Fingerstock Beryllium Copper - 0.230" (5.84mm) 24.000" (609.60mm) Unplated - Adhesive
23-S-60FSV50-BD-24
Leader Tech Inc.
Consulta
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MOQ: 1  MPQ: 1
0.23 X 0.60 BD 24--FOLDED SERIES
- -55°C ~ 121°C Fingerstock Beryllium Copper - 0.230" (5.84mm) 24.000" (609.60mm) Unplated - Adhesive
23-60FS-BD-24-NTP
Leader Tech Inc.
Consulta
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MOQ: 1  MPQ: 1
0.23 X 0.60 BD 24 NTP--FOLDED SE
- -55°C ~ 121°C Fingerstock Beryllium Copper - 0.230" (5.84mm) 24.000" (609.60mm) Unplated - Adhesive
23-60FS-MAG-24
Leader Tech Inc.
Consulta
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MOQ: 1  MPQ: 1
0.23 X 0.60 MAG 24--FOLDED SERIE
- -55°C ~ 121°C Fingerstock Beryllium Copper - 0.230" (5.84mm) 24.000" (609.60mm) Silver Flash Adhesive
23-S-60FS-BD-24
Leader Tech Inc.
Consulta
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MOQ: 1  MPQ: 1
0.23 X 0.60 BD 24--FOLDED SERIES
- -55°C ~ 121°C Fingerstock Beryllium Copper - 0.230" (5.84mm) 24.000" (609.60mm) Unplated - Adhesive
23-60FS-SNPB-24
Leader Tech Inc.
Consulta
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MOQ: 1  MPQ: 1
0.23 X 0.60 SNPB 24--FOLDED SERI
- -55°C ~ 121°C Fingerstock Beryllium Copper - 0.230" (5.84mm) 24.000" (609.60mm) Lead,Tin Flash Adhesive
23-60FSV50-SN-24
Leader Tech Inc.
Consulta
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MOQ: 1  MPQ: 1
0.23 X 0.60 SN 24--FOLDED SERIES
- -55°C ~ 121°C Fingerstock Beryllium Copper - 0.230" (5.84mm) 24.000" (609.60mm) Tin Flash Adhesive
23-60FS-SN-24
Leader Tech Inc.
Consulta
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MOQ: 1  MPQ: 1
0.23 X 0.60 SN 24--FOLDED SERIES
- -55°C ~ 121°C Fingerstock Beryllium Copper - 0.230" (5.84mm) 24.000" (609.60mm) Tin Flash Adhesive
23-60FS-NI-24
Leader Tech Inc.
Consulta
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MOQ: 1  MPQ: 1
0.23 X 0.60 NI 24--FOLDED SERIES
- -55°C ~ 121°C Fingerstock Beryllium Copper - 0.230" (5.84mm) 24.000" (609.60mm) Nickel Flash Adhesive
SG040060D-30.00
Leader Tech Inc.
Consulta
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MOQ: 1  MPQ: 1
.040"H X .060"W X 30"L--D SHAPED
- -40°C ~ 70°C Fabric Over Foam Polyurethane Foam,Nickel-Copper Polyester (NI/CU) D-Shape 0.040" (1.02mm) 30.000" (762.00mm) - - -