Descubre los productos 38
La imagen Número de pieza Fabricante Cantidad Plazo de entrega Precio unitario Comprar Descripción Series Operating Temperature Type Material Shape Length Width Plating Plating - Thickness Attachment Method
331011452535
Wurth Electronics Inc.
Consulta
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MOQ: 1  MPQ: 1
WE-SECF SMD EMI CONTACT FINGER
WE-SECF -40°C ~ 100°C Shield Finger Beryllium Copper - 0.177" (4.50mm) 0.098" (2.50mm) Gold Flash Solder
331011452535
Wurth Electronics Inc.
1,916
3 dias
-
MOQ: 1  MPQ: 1
WE-SECF SMD EMI CONTACT FINGER
WE-SECF -40°C ~ 100°C Shield Finger Beryllium Copper - 0.177" (4.50mm) 0.098" (2.50mm) Gold Flash Solder
331011452535
Wurth Electronics Inc.
1,916
3 dias
-
MOQ: 1  MPQ: 1
WE-SECF SMD EMI CONTACT FINGER
WE-SECF -40°C ~ 100°C Shield Finger Beryllium Copper - 0.177" (4.50mm) 0.098" (2.50mm) Gold Flash Solder
4594PA51H01800
Laird Technologies EMI
96
3 dias
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MOQ: 1  MPQ: 1
GASKET FAB/FOAM 8.9X457.2MM RECT
- - Fabric Over Foam Polyurethane Foam,Nickel-Copper Taffeta (NI/CU) Rectangle 18.000" (457.20mm) 0.350" (8.90mm) - - Adhesive
303085035
Wurth Electronics Inc.
10
3 dias
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MOQ: 1  MPQ: 1
WE-LT CONDUCTIVE SHIELDING GASKE
WE-LT -40°C ~ 85°C Fabric Over Foam Polyurethane Foam,Rayon Paper D-Shape 39.370" (1.00m) 0.335" (8.50mm) - - Non-Conductive Adhesive
1447009-8
TE Connectivity AMP Connectors
20,000
3 dias
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MOQ: 1  MPQ: 1
SHIELDFINGER3525Z
- - Shield Finger Copper Alloy - 0.177" (4.50mm) 0.098" (2.50mm) Gold 1.967μin (0.05μm) Solder
1447009-8
TE Connectivity AMP Connectors
20,581
3 dias
-
MOQ: 1  MPQ: 1
SHIELDFINGER3525Z
- - Shield Finger Copper Alloy - 0.177" (4.50mm) 0.098" (2.50mm) Gold 1.967μin (0.05μm) Solder
1447009-8
TE Connectivity AMP Connectors
20,581
3 dias
-
MOQ: 1  MPQ: 1
SHIELDFINGER3525Z
- - Shield Finger Copper Alloy - 0.177" (4.50mm) 0.098" (2.50mm) Gold 1.967μin (0.05μm) Solder
1447009-7
TE Connectivity AMP Connectors
16,000
3 dias
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MOQ: 1  MPQ: 1
SHIELD FINGER 3525
- - Shield Finger - - 0.177" (4.50mm) 0.098" (2.50mm) - - Solder
1447009-7
TE Connectivity AMP Connectors
16,671
3 dias
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MOQ: 1  MPQ: 1
SHIELD FINGER 3525
- - Shield Finger - - 0.177" (4.50mm) 0.098" (2.50mm) - - Solder
67SLG040035030PI00
Laird Technologies EMI
Consulta
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MOQ: 1  MPQ: 1
METAL FILM OVER FOAM CONTACTS
- -40°C ~ 70°C Film Over Foam Polyurethane Foam,Tin-Copper Polyester (SN/CU) Rectangle 0.118" (3.00mm) 0.157" (4.00mm) - - Solder
67SLG040035030PI00
Laird Technologies EMI
125
3 dias
-
MOQ: 1  MPQ: 1
METAL FILM OVER FOAM CONTACTS
- -40°C ~ 70°C Film Over Foam Polyurethane Foam,Tin-Copper Polyester (SN/CU) Rectangle 0.118" (3.00mm) 0.157" (4.00mm) - - Solder
67SLG040035030PI00
Laird Technologies EMI
125
3 dias
-
MOQ: 1  MPQ: 1
METAL FILM OVER FOAM CONTACTS
- -40°C ~ 70°C Film Over Foam Polyurethane Foam,Tin-Copper Polyester (SN/CU) Rectangle 0.118" (3.00mm) 0.157" (4.00mm) - - Solder
10118532-003RLF
Amphenol FCI
Consulta
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MOQ: 1  MPQ: 1
ANTENNA 3.5H TI CU G/F P
- - Shield Finger,Pre-Loaded Beryllium Copper Alloy - 0.197" (5.00mm) 0.055" (1.40mm) Gold Flash Solder
10104321-009RLF
Amphenol FCI
Consulta
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MOQ: 1  MPQ: 1
3.50MM HEIGHT UNIVERSAL CONTACT
- - Shield Finger,Pre-Loaded Beryllium Copper Alloy - 0.197" (5.00mm) 0.043" (1.10mm) Gold Flash Solder
4594PA51H01200
Laird Technologies EMI
Consulta
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MOQ: 1  MPQ: 1
GK NICU PTAFG PU V0 REC
- - Fabric Over Foam Polyurethane Foam,Nickel-Copper Taffeta (NI/CU) Rectangle 12.000" (304.80mm) 0.350" (8.90mm) - - Adhesive
4594AB51K03937
Laird Technologies EMI
Consulta
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MOQ: 1  MPQ: 1
GK NICU NRS PU V0 REC
- - Fabric Over Foam Polyurethane Foam,Nickel-Copper Polyester (NI/CU) Rectangle 39.370" (100.00cm) 0.350" (8.90mm) - - -
10076432-009RLF
Amphenol FCI
Consulta
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MOQ: 1  MPQ: 1
SPRINT CONTACT GOLD
- - Shield Finger,Pre-Loaded Beryllium Copper Alloy - 0.197" (5.00mm) 0.043" (1.10mm) Gold Flash Solder