- Operating Temperature：
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- Shape：
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- Length：
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- Width：
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- Plating：
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- Plating - Thickness：
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- Attachment Method：
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- Condiciones seleccionadas:
Descubre los productos 74
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Operating Temperature | Type | Material | Shape | Length | Width | Plating | Plating - Thickness | Attachment Method | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Operating Temperature | Type | Material | Shape | Length | Width | Plating | Plating - Thickness | Attachment Method | |
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Laird Technologies EMI |
Consulta
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- |
-
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MOQ: 1 MPQ: 1
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S3,STR,NIE,PSA
|
- | 121°C | Fingerstock | Beryllium Copper | - | 15.000" (381.00mm) | 0.450" (11.43mm) | Nickel | 299.21μin (7.60μm) | Adhesive | ||
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Laird Technologies EMI |
Consulta
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- |
-
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MOQ: 1 MPQ: 1
|
S3,STR,NIB,PSA
|
- | 121°C | Fingerstock | Beryllium Copper | - | 15.000" (381.00mm) | 0.450" (11.43mm) | Nickel | 299.21μin (7.60μm) | Adhesive | ||
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Laird Technologies EMI |
Consulta
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- |
-
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MOQ: 1 MPQ: 1
|
TWT,STR,SNB,CLO
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- | 121°C | Fingerstock | Beryllium Copper | - | 16.000" (406.40mm) | 0.210" (5.33mm) | Tin | 299.21μin (7.60μm) | Clip | ||
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Laird Technologies EMI |
Consulta
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- |
-
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MOQ: 1 MPQ: 1
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AP,STR,ZNC,RA
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- | 121°C | Fingerstock | Beryllium Copper | - | 16.000" (406.40mm) | 0.370" (9.40mm) | Zinc + Clear Chromate | 299.21μin (7.60μm) | Adhesive | ||
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Laird Technologies EMI |
Consulta
|
- |
-
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MOQ: 1 MPQ: 1
|
AP,STR,SNB,RA
|
- | 121°C | Fingerstock | Beryllium Copper | - | 16.000" (406.40mm) | 0.370" (9.40mm) | Tin | 299.21μin (7.60μm) | Adhesive | ||
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Laird Technologies EMI |
Consulta
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- |
-
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MOQ: 1 MPQ: 1
|
NOSG,STR,SNB,PSA
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Foldover | 121°C | Fingerstock | Beryllium Copper | - | 16.000" (406.40mm) | 0.510" (12.95mm) | Tin | 299.21μin (7.60μm) | Adhesive | ||
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Laird Technologies EMI |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
NOSG,STR,NIB,PSA
|
Foldover | 121°C | Fingerstock | Beryllium Copper | - | 16.000" (406.40mm) | 0.510" (12.95mm) | Nickel | 299.21μin (7.60μm) | Adhesive | ||
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Laird Technologies EMI |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
AP,STR,SNSAT,PSA
|
- | 121°C | Fingerstock | Beryllium Copper | - | 16.000" (406.40mm) | 0.370" (9.40mm) | Tin | 299.21μin (7.60μm) | Adhesive | ||
|
|
|
Laird Technologies EMI |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
AP,STR,SNB,PSA
|
- | 121°C | Fingerstock | Beryllium Copper | - | 16.000" (406.40mm) | 0.370" (9.40mm) | Tin | 299.21μin (7.60μm) | Adhesive | ||
|
|
|
Laird Technologies EMI |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
AP,STR,NIB,PSA
|
- | 121°C | Fingerstock | Beryllium Copper | - | 16.000" (406.40mm) | 0.370" (9.40mm) | Nickel | 299.21μin (7.60μm) | Adhesive | ||
|
|
|
Laird Technologies EMI |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
S3,STR,NIB,RIV
|
- | 121°C | Fingerstock | Beryllium Copper | - | 15.000" (381.00mm) | 0.450" (11.43mm) | Nickel | 299.21μin (7.60μm) | Rivet | ||
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Laird Technologies EMI |
Consulta
|
- |
-
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MOQ: 1 MPQ: 1
|
S3,STR,NIB,RIVIT
|
- | 121°C | Fingerstock | Beryllium Copper | - | 15.000" (381.00mm) | 0.450" (11.43mm) | Nickel | 299.21μin (7.60μm) | Rivet | ||
|
|
|
Laird Technologies EMI |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
S3,STR,NIE,RIV
|
- | 121°C | Fingerstock | Beryllium Copper | - | 15.000" (381.00mm) | 0.450" (11.43mm) | Nickel | 299.21μin (7.60μm) | Rivet | ||
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|
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Laird Technologies EMI |
Consulta
|
- |
-
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MOQ: 1 MPQ: 1
|
AP,STR,BF
|
- | 121°C | Fingerstock | Beryllium Copper | - | 16.000" (406.40mm) | 0.370" (9.40mm) | - | - | Adhesive | ||
|
|
|
Laird Technologies EMI |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
S3,STR,ZNC,RIV
|
- | 121°C | Fingerstock | Beryllium Copper | - | 15.000" (381.00mm) | 0.450" (11.43mm) | Zinc + Clear Chromate | 299.21μin (7.60μm) | Rivet | ||
|
|
|
Laird Technologies EMI |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
S3,STR,SNB,RIV
|
- | 121°C | Fingerstock | Beryllium Copper | - | 15.000" (381.00mm) | 0.450" (11.43mm) | Tin | 299.21μin (7.60μm) | Rivet | ||
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|
|
Laird Technologies EMI |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
TWT,STR,SNPB,DLN
|
- | 121°C | Fingerstock | Beryllium Copper | - | 16.000" (406.40mm) | 0.210" (5.33mm) | Lead，Tin | 299.21μin (7.60μm) | Clip | ||
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Laird Technologies EMI |
Consulta
|
- |
-
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MOQ: 1 MPQ: 1
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AP COIL NIB PSA
|
All-Purpose | 121°C | Fingerstock | Beryllium Copper | - | 16.000" (406.40mm) | 0.370" (9.40mm) | Nickel | 299.21μin (7.60μm) | Adhesive | |||
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Laird Technologies EMI |
Consulta
|
- |
-
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MOQ: 1 MPQ: 1
|
STS3,STR,ZNY,USFT
|
- | 121°C | Fingerstock | Beryllium Copper | - | 15.000" (381.00mm) | 0.450" (11.43mm) | Zinc + Yellow Chromate | 299.21μin (7.60μm) | Adhesive | |||
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Laird Technologies EMI |
Consulta
|
- |
-
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MOQ: 1 MPQ: 1
|
S3,STR,NID,USFT,PSA
|
- | 121°C | Fingerstock | Beryllium Copper | - | 15.000" (381.00mm) | 0.450" (11.43mm) | Nickel | 299.21μin (7.60μm) | Adhesive |
