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- Operating Temperature:
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- Height:
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- Condiciones seleccionadas:
Descubre los productos 1,795
La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Operating Temperature | Type | Material | Height | Length | Width | Plating | Plating - Thickness | Attachment Method | ||
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Operating Temperature | Type | Material | Height | Length | Width | Plating | Plating - Thickness | Attachment Method | ||
Laird Technologies EMI |
Consulta
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- |
-
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MOQ: 1 MPQ: 1
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TWT,STR,ZNC,USFT,PSA
|
Twist | 121°C | Fingerstock | Beryllium Copper | 0.070" (1.78mm) | 24.000" (609.60mm) | 0.300" (7.62mm) | Zinc + Clear Chromate | 299.21μin (7.60μm) | Adhesive | ||||
Laird Technologies EMI |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
LS,STR,BF
|
- | 121°C | Fingerstock | Beryllium Copper | 0.300" (7.62mm) | 18.750" (476.25mm) | 0.800" (20.32mm) | - | - | Hardware | ||||
Laird Technologies EMI |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
TWT,STR,SNB,PSA
|
Twist | 121°C | Fingerstock | Beryllium Copper | 0.070" (1.78mm) | 24.000" (609.60mm) | 0.500" (12.70mm) | Tin | 299.21μin (7.60μm) | Adhesive | ||||
Laird Technologies EMI |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
S3,STR,BF,RIV
|
- | 121°C | Fingerstock | Beryllium Copper | 0.110" (2.79mm) | 15.000" (381.00mm) | 0.350" (8.89mm) | - | - | Rivet | ||||
Laird Technologies EMI |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
NOSG,STR,ZNC,PSA
|
Foldover | 121°C | Fingerstock | Beryllium Copper | 0.120" (3.05mm) | 16.000" (406.40mm) | 0.380" (9.65mm) | Zinc + Clear Chromate | 299.21μin (7.60μm) | Adhesive | ||||
Laird Technologies EMI |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
AP,STR,SNSAT,RA
|
- | 121°C | Fingerstock | Beryllium Copper | 0.110" (2.79mm) | 16.000" (406.40mm) | 0.260" (6.60mm) | Tin | 299.21μin (7.60μm) | Adhesive | ||||
Laird Technologies EMI |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
AP,STR,SNB,RA
|
- | 121°C | Fingerstock | Beryllium Copper | 0.110" (2.79mm) | 16.000" (406.40mm) | 0.260" (6.60mm) | Tin | 299.21μin (7.60μm) | Adhesive | ||||
Laird Technologies EMI |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
NOSG,STR,SNB,PSA
|
Foldover | 121°C | Fingerstock | Beryllium Copper | 0.120" (3.05mm) | 16.000" (406.40mm) | 0.380" (9.65mm) | Tin | 299.21μin (7.60μm) | Adhesive | ||||
Laird Technologies EMI |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
VSLMT,STR,ZNC,CTL
|
- | - | - | - | - | - | - | - | - | - | ||||
Laird Technologies EMI |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
AP,STR,ZNC,RA
|
- | 121°C | Fingerstock | Beryllium Copper | 0.140" (3.56mm) | 16.000" (406.40mm) | 0.370" (9.40mm) | Zinc + Clear Chromate | 299.21μin (7.60μm) | Adhesive | ||||
Laird Technologies EMI |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
AP,STR,SNB,RA
|
- | 121°C | Fingerstock | Beryllium Copper | 0.140" (3.56mm) | 16.000" (406.40mm) | 0.370" (9.40mm) | Tin | 299.21μin (7.60μm) | Adhesive | ||||
Laird Technologies EMI |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
TWT,STR,BF,USFT
|
Twist | 121°C | Fingerstock | Beryllium Copper | 0.070" (1.78mm) | 24.000" (609.60mm) | 0.200" (5.08mm) | - | - | Adhesive | ||||
Laird Technologies EMI |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
AP,STR,NID,PSA
|
- | 121°C | Fingerstock | Beryllium Copper | 0.110" (2.79mm) | 16.000" (406.40mm) | 0.280" (7.11mm) | Nickel | 299.21μin (7.60μm) | Adhesive | ||||
Laird Technologies EMI |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
AP,STR,ZNC,PSA
|
- | 121°C | Fingerstock | Beryllium Copper | 0.110" (2.79mm) | 16.000" (406.40mm) | 0.280" (7.11mm) | Zinc + Clear Chromate | 299.21μin (7.60μm) | Adhesive | ||||
Laird Technologies EMI |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
AP,STR,ZNY,PSA
|
- | 121°C | Fingerstock | Beryllium Copper | 0.110" (2.79mm) | 16.000" (406.40mm) | 0.280" (7.11mm) | Zinc + Yellow Chromate | 299.21μin (7.60μm) | Adhesive | ||||
Laird Technologies EMI |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
AP,STR,NIE,PSA
|
- | 121°C | Fingerstock | Beryllium Copper | 0.110" (2.79mm) | 16.000" (406.40mm) | 0.280" (7.11mm) | Nickel | 299.21μin (7.60μm) | Adhesive | ||||
Laird Technologies EMI |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
AP,STR,NIB,PSA
|
- | 121°C | Fingerstock | Beryllium Copper | 0.110" (2.79mm) | 16.000" (406.40mm) | 0.280" (7.11mm) | Nickel | 299.21μin (7.60μm) | Adhesive | ||||
Laird Technologies EMI |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
NOSG,STR,SNB,PSA
|
Foldover | 121°C | Fingerstock | Beryllium Copper | 0.140" (3.56mm) | 16.000" (406.40mm) | 0.510" (12.95mm) | Tin | 299.21μin (7.60μm) | Adhesive | ||||
Laird Technologies EMI |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
NOSG,STR,NIB,PSA
|
Foldover | 121°C | Fingerstock | Beryllium Copper | 0.140" (3.56mm) | 16.000" (406.40mm) | 0.510" (12.95mm) | Nickel | 299.21μin (7.60μm) | Adhesive | ||||
Laird Technologies EMI |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
AP,STR,SNSAT,PSA
|
- | 121°C | Fingerstock | Beryllium Copper | 0.140" (3.56mm) | 16.000" (406.40mm) | 0.370" (9.40mm) | Tin | 299.21μin (7.60μm) | Adhesive |