- Packaging：
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- Applications：
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- Voltage - Supply：
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- Supplier Device Package：
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- Mounting Type：
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- Current - Supply：
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- Condiciones seleccionadas:
Descubre los productos 76
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Packaging | Applications | Voltage - Supply | Package / Case | Supplier Device Package | Mounting Type | Current - Supply | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Packaging | Applications | Voltage - Supply | Package / Case | Supplier Device Package | Mounting Type | Current - Supply | |
|
|
|
Active-Semi International Inc. |
87,000
|
3 dias |
-
|
MOQ: 3000 MPQ: 1
|
IC PMU CONV/LDO REG 32TQFN
|
Tape & Reel (TR) | Processor | 2.7 V ~ 5.5 V | 32-WFQFN Exposed Pad | 32-TQFN (4x4) | Surface Mount | 14mA | ||
|
|
|
Active-Semi International Inc. |
87,315
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
IC PMU CONV/LDO REG 32TQFN
|
Cut Tape (CT) | Processor | 2.7 V ~ 5.5 V | 32-WFQFN Exposed Pad | 32-TQFN (4x4) | Surface Mount | 14mA | ||
|
|
|
Active-Semi International Inc. |
87,315
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
IC PMU CONV/LDO REG 32TQFN
|
- | Processor | 2.7 V ~ 5.5 V | 32-WFQFN Exposed Pad | 32-TQFN (4x4) | Surface Mount | 14mA | ||
|
|
|
Active-Semi International Inc. |
3,000
|
3 dias |
-
|
MOQ: 3000 MPQ: 1
|
IC PWR MGMT 8 LDO
|
Tape & Reel (TR) | Processor | 3 V ~ 5.5 V | 48-WFQFN Exposed Pad | 48-TQFN (6x6) | Surface Mount | 600μA | ||
|
|
|
Active-Semi International Inc. |
3,559
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
IC PWR MGMT 8 LDO
|
Cut Tape (CT) | Processor | 3 V ~ 5.5 V | 48-WFQFN Exposed Pad | 48-TQFN (6x6) | Surface Mount | 600μA | ||
|
|
|
Active-Semi International Inc. |
3,559
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
IC PWR MGMT 8 LDO
|
- | Processor | 3 V ~ 5.5 V | 48-WFQFN Exposed Pad | 48-TQFN (6x6) | Surface Mount | 600μA | ||
|
|
|
Active-Semi International Inc. |
3,000
|
3 dias |
-
|
MOQ: 3000 MPQ: 1
|
IC REG BUCK LDO 48TQFN
|
Tape & Reel (TR) | Processor | 3 V ~ 5.5 V | 48-WFQFN Exposed Pad | 48-TQFN (6x6) | Surface Mount | 600μA | ||
|
|
|
Active-Semi International Inc. |
3,000
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
IC REG BUCK LDO 48TQFN
|
Cut Tape (CT) | Processor | 3 V ~ 5.5 V | 48-WFQFN Exposed Pad | 48-TQFN (6x6) | Surface Mount | 600μA | ||
|
|
|
Active-Semi International Inc. |
3,000
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
IC REG BUCK LDO 48TQFN
|
- | Processor | 3 V ~ 5.5 V | 48-WFQFN Exposed Pad | 48-TQFN (6x6) | Surface Mount | 600μA | ||
|
|
|
Active-Semi International Inc. |
3,000
|
3 dias |
-
|
MOQ: 3000 MPQ: 1
|
IC REG BUCK LDO 48TQFN
|
Tape & Reel (TR) | Processor | 3 V ~ 5.5 V | 48-WFQFN Exposed Pad | 48-TQFN (6x6) | Surface Mount | 600μA | ||
|
|
|
Active-Semi International Inc. |
3,000
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
IC REG BUCK LDO 48TQFN
|
Cut Tape (CT) | Processor | 3 V ~ 5.5 V | 48-WFQFN Exposed Pad | 48-TQFN (6x6) | Surface Mount | 600μA | ||
|
|
|
Active-Semi International Inc. |
3,000
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
IC REG BUCK LDO 48TQFN
|
- | Processor | 3 V ~ 5.5 V | 48-WFQFN Exposed Pad | 48-TQFN (6x6) | Surface Mount | 600μA | ||
|
|
|
Active-Semi International Inc. |
3,000
|
3 dias |
-
|
MOQ: 3000 MPQ: 1
|
IC REG BUCK LDO 48TQFN
|
Tape & Reel (TR) | Handheld/Mobile Devices | 1.7 V ~ 5.5 V | 48-WFQFN Exposed Pad | 48-TQFN (6x6) | Surface Mount | - | ||
|
|
|
Active-Semi International Inc. |
3,000
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
IC REG BUCK LDO 48TQFN
|
Cut Tape (CT) | Handheld/Mobile Devices | 1.7 V ~ 5.5 V | 48-WFQFN Exposed Pad | 48-TQFN (6x6) | Surface Mount | - | ||
|
|
|
Active-Semi International Inc. |
3,000
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
IC REG BUCK LDO 48TQFN
|
- | Handheld/Mobile Devices | 1.7 V ~ 5.5 V | 48-WFQFN Exposed Pad | 48-TQFN (6x6) | Surface Mount | - | ||
|
|
|
Active-Semi International Inc. |
3,000
|
3 dias |
-
|
MOQ: 3000 MPQ: 1
|
IC REG BUCK LDO 48TQFN
|
Tape & Reel (TR) | Handheld/Mobile Devices | 1.7 V ~ 5.5 V | 48-WFQFN Exposed Pad | 48-TQFN (6x6) | Surface Mount | - | ||
|
|
|
Active-Semi International Inc. |
3,000
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
IC REG BUCK LDO 48TQFN
|
Cut Tape (CT) | Handheld/Mobile Devices | 1.7 V ~ 5.5 V | 48-WFQFN Exposed Pad | 48-TQFN (6x6) | Surface Mount | - | ||
|
|
|
Active-Semi International Inc. |
3,000
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
IC REG BUCK LDO 48TQFN
|
- | Handheld/Mobile Devices | 1.7 V ~ 5.5 V | 48-WFQFN Exposed Pad | 48-TQFN (6x6) | Surface Mount | - | ||
|
|
|
Active-Semi International Inc. |
3,000
|
3 dias |
-
|
MOQ: 3000 MPQ: 1
|
IC REG BUCK LDO 48TQFN
|
Tape & Reel (TR) | Processor | 3 V ~ 5.5 V | 48-WFQFN Exposed Pad | 48-TQFN (6x6) | Surface Mount | 600μA | ||
|
|
|
Active-Semi International Inc. |
3,000
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
IC REG BUCK LDO 48TQFN
|
Cut Tape (CT) | Processor | 3 V ~ 5.5 V | 48-WFQFN Exposed Pad | 48-TQFN (6x6) | Surface Mount | 600μA |
