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- Package / Case:
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- Supplier Device Package:
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- Architecture:
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- Peripherals:
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- Primary Attributes:
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Descubre los productos 2,120
La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Packaging | Series | Operating Temperature | Package / Case | Supplier Device Package | Architecture | Peripherals | Primary Attributes | Core Processor | Speed | Flash Size | RAM Size | Connectivity | ||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Packaging | Series | Operating Temperature | Package / Case | Supplier Device Package | Architecture | Peripherals | Primary Attributes | Core Processor | Speed | Flash Size | RAM Size | Connectivity | ||
Xilinx Inc. |
54
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
IC SOC CORTEX-A9 ARTIX-7 485BGA
|
Tray | Zynq-7000 | -40°C ~ 100°C (TJ) | 484-LFBGA,CSPBGA | 485-CSBGA (19x19) | MCU,FPGA | DMA | Artix®-7 FPGA,74K Logic Cells | Dual ARM® Cortex®-A9 MPCore® with CoreSight® | 766MHz | - | 256kB | CANbus,EBI/EMI,Ethernet,I2C,MMC/SD/SDIO,SPI,UART/USART,USB OTG | ||||
Xilinx Inc. |
33
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
IC SOC CORTEX A-9 ZYNQ7 485BGA
|
Tray | Zynq-7000 | 0°C ~ 85°C (TJ) | 484-FBGA | 485-FBGA (19x19) | MCU,FPGA | DMA | Kintex®-7 FPGA,125K Logic Cells | Dual ARM® Cortex®-A9 MPCore® with CoreSight® | 667MHz | - | 256kB | CANbus,EBI/EMI,Ethernet,I2C,MMC/SD/SDIO,SPI,UART/USART,USB OTG | ||||
Xilinx Inc. |
177
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
IC SOC CORTEX-A9 KINTEX7 676FBGA
|
Tray | Zynq-7000 | 0°C ~ 85°C (TJ) | 676-BBGA,FCBGA | 676-FCBGA (27x27) | MCU,FPGA | DMA | Kintex®-7 FPGA,125K Logic Cells | Dual ARM® Cortex®-A9 MPCore® with CoreSight® | 667MHz | - | 256kB | CANbus,EBI/EMI,Ethernet,I2C,MMC/SD/SDIO,SPI,UART/USART,USB OTG | ||||
Xilinx Inc. |
111
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
IC SOC CORTEX-A9 KINTEX7 484FBGA
|
Tray | Zynq-7000 | -40°C ~ 100°C (TJ) | 484-BBGA,FCBGA | 484-FCBGA (23x23) | MCU,FPGA | DMA | Kintex®-7 FPGA,125K Logic Cells | Dual ARM® Cortex®-A9 MPCore® with CoreSight® | 667MHz | - | 256kB | CANbus,EBI/EMI,Ethernet,I2C,MMC/SD/SDIO,SPI,UART/USART,USB OTG | ||||
Xilinx Inc. |
150
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
IC SOC CORTEX A-9 ZYNQ7 485BGA
|
Tray | Zynq-7000 | -40°C ~ 100°C (TJ) | 484-FBGA | 485-FBGA (19x19) | MCU,FPGA | DMA | Kintex®-7 FPGA,125K Logic Cells | Dual ARM® Cortex®-A9 MPCore® with CoreSight® | 667MHz | - | 256kB | CANbus,EBI/EMI,Ethernet,I2C,MMC/SD/SDIO,SPI,UART/USART,USB OTG | ||||
Xilinx Inc. |
103
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
IC SOC CORTEX-A9 KINTEX7 676FBGA
|
Tray | Zynq-7000 | -40°C ~ 100°C (TJ) | 676-BBGA,FCBGA | 676-FCBGA (27x27) | MCU,FPGA | DMA | Kintex®-7 FPGA,125K Logic Cells | Dual ARM® Cortex®-A9 MPCore® with CoreSight® | 667MHz | - | 256kB | CANbus,EBI/EMI,Ethernet,I2C,MMC/SD/SDIO,SPI,UART/USART,USB OTG | ||||
Xilinx Inc. |
81
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
IC SOC CORTEX-A9 KINTEX7 484FBGA
|
Tray | Zynq-7000 | -40°C ~ 100°C (TJ) | 484-BBGA,FCBGA | 484-FCBGA (23x23) | MCU,FPGA | DMA | Kintex®-7 FPGA,125K Logic Cells | Dual ARM® Cortex®-A9 MPCore® with CoreSight® | 800MHz | - | 256kB | CANbus,EBI/EMI,Ethernet,I2C,MMC/SD/SDIO,SPI,UART/USART,USB OTG | ||||
Xilinx Inc. |
48
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
IC SOC CORTEX-A9 KINTEX7 676FBGA
|
Tray | Zynq-7000 | 0°C ~ 85°C (TJ) | 676-BBGA,FCBGA | 676-FCBGA (27x27) | MCU,FPGA | DMA | Kintex®-7 FPGA,125K Logic Cells | Dual ARM® Cortex®-A9 MPCore® with CoreSight® | 667MHz | - | 256kB | CANbus,EBI/EMI,Ethernet,I2C,MMC/SD/SDIO,SPI,UART/USART,USB OTG | ||||
Xilinx Inc. |
83
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
IC SOC CORTEX-A9 KINTEX7 676FBGA
|
Tray | Zynq-7000 | -40°C ~ 100°C (TJ) | 676-BBGA,FCBGA | 676-FCBGA (27x27) | MCU,FPGA | DMA | Kintex®-7 FPGA,125K Logic Cells | Dual ARM® Cortex®-A9 MPCore® with CoreSight® | 800MHz | - | 256kB | CANbus,EBI/EMI,Ethernet,I2C,MMC/SD/SDIO,SPI,UART/USART,USB OTG | ||||
Xilinx Inc. |
92
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
IC SOC CORTEX-A9 KINTEX7 676FBGA
|
Tray | Zynq-7000 | -40°C ~ 100°C (TJ) | 676-BBGA,FCBGA | 676-FCBGA (27x27) | MCU,FPGA | DMA | Kintex®-7 FPGA,125K Logic Cells | Dual ARM® Cortex®-A9 MPCore® with CoreSight® | 667MHz | - | 256kB | CANbus,EBI/EMI,Ethernet,I2C,MMC/SD/SDIO,SPI,UART/USART,USB OTG | ||||
Xilinx Inc. |
70
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
IC SOC CORTEX-A9 KINTEX7 676FBGA
|
Tray | Zynq-7000 | -40°C ~ 100°C (TJ) | 676-BBGA,FCBGA | 676-FCBGA (27x27) | MCU,FPGA | DMA | Kintex®-7 FPGA,125K Logic Cells | Dual ARM® Cortex®-A9 MPCore® with CoreSight® | 800MHz | - | 256kB | CANbus,EBI/EMI,Ethernet,I2C,MMC/SD/SDIO,SPI,UART/USART,USB OTG | ||||
Xilinx Inc. |
47
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
IC SOC CORTEX-A9 KINTEX7 676FBGA
|
Tray | Zynq-7000 | -40°C ~ 100°C (TJ) | 676-BBGA,FCBGA | 676-FCBGA (27x27) | MCU,FPGA | DMA | Kintex®-7 FPGA,350K Logic Cells | Dual ARM® Cortex®-A9 MPCore® with CoreSight® | 800MHz | - | 256kB | CANbus,EBI/EMI,Ethernet,I2C,MMC/SD/SDIO,SPI,UART/USART,USB OTG | ||||
Intel |
81
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
IC FPGA 188 I/O 672UBGA
|
Tray | Cyclone V SE | -40°C ~ 100°C (TJ) | 672-FBGA | 672-UBGA (23x23) | MCU,FPGA | DMA,POR,WDT | FPGA - 25K Logic Elements | Dual ARM® Cortex®-A9 MPCore® with CoreSight® | 800MHz | - | 64kB | CANbus,EBI/EMI,Ethernet,I2C,MMC/SD/SDIO,SPI,UART/USART,USB OTG | ||||
Xilinx Inc. |
36
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
IC FPGA SOC 200I/O 484BGA
|
Tray | Zynq-7000 | -40°C ~ 100°C (TJ) | 484-LFBGA,CSPBGA | 484-CSPBGA (19x19) | MCU,FPGA | DMA | Artix®-7 FPGA,65K Logic Cells | Single ARM® Cortex®-A9 MPCore® with CoreSight® | 667MHz | - | 256kB | CANbus,EBI/EMI,Ethernet,I2C,MMC/SD/SDIO,SPI,UART/USART,USB OTG | ||||
Intel |
111
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
IC FPGA 224 I/O 672UBGA
|
Tray | Cyclone V SE | 0°C ~ 85°C (TJ) | 672-FBGA | 672-UBGA (23x23) | MCU,FPGA | DMA,POR,WDT | FPGA - 40K Logic Elements | Dual ARM® Cortex®-A9 MPCore® with CoreSight® | 925MHz | - | 64kB | CANbus,EBI/EMI,Ethernet,I2C,MMC/SD/SDIO,SPI,UART/USART,USB OTG | ||||
Intel |
48
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
IC FPGA 288 I/O 896FBGA
|
Tray | Cyclone V SX | 0°C ~ 85°C (TJ) | 896-BGA | 896-FBGA (31x31) | MCU,FPGA | DMA,POR,WDT | FPGA - 110K Logic Elements | Dual ARM® Cortex®-A9 MPCore® with CoreSight® | 600MHz | - | 64kB | CANbus,EBI/EMI,Ethernet,I2C,MMC/SD/SDIO,SPI,UART/USART,USB OTG | ||||
Intel |
83
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
IC FPGA 66 I/O 484UBGA
|
Tray | Cyclone V SE | -40°C ~ 100°C (TJ) | 484-FBGA | 484-UBGA (19x19) | MCU,FPGA | DMA,POR,WDT | FPGA - 110K Logic Elements | Dual ARM® Cortex®-A9 MPCore® with CoreSight® | 800MHz | - | 64kB | CANbus,EBI/EMI,Ethernet,I2C,MMC/SD/SDIO,SPI,UART/USART,USB OTG | ||||
Intel |
81
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
IC FPGA 145 I/O 672UBGA
|
Tray | Cyclone V SE | 0°C ~ 85°C (TJ) | 672-FBGA | 672-UBGA (23x23) | MCU,FPGA | DMA,POR,WDT | FPGA - 110K Logic Elements | Dual ARM® Cortex®-A9 MPCore® with CoreSight® | 925MHz | - | 64kB | CANbus,EBI/EMI,Ethernet,I2C,MMC/SD/SDIO,SPI,UART/USART,USB OTG | ||||
Intel |
38
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
IC FPGA 145 I/O 672UBGA
|
Tray | Cyclone V SE | -40°C ~ 100°C (TJ) | 672-FBGA | 672-UBGA (23x23) | MCU,FPGA | DMA,POR,WDT | FPGA - 110K Logic Elements | Dual ARM® Cortex®-A9 MPCore® with CoreSight® | 800MHz | - | 64kB | CANbus,EBI/EMI,Ethernet,I2C,MMC/SD/SDIO,SPI,UART/USART,USB OTG | ||||
Intel |
110
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
IC FPGA 145 I/O 672UBGA
|
Tray | Cyclone V SX | -40°C ~ 100°C (TJ) | 672-FBGA | 672-UBGA (23x23) | MCU,FPGA | DMA,POR,WDT | FPGA - 110K Logic Elements | Dual ARM® Cortex®-A9 MPCore® with CoreSight® | 800MHz | - | 64kB | CANbus,EBI/EMI,Ethernet,I2C,MMC/SD/SDIO,SPI,UART/USART,USB OTG |