- Operating Temperature：
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- Package / Case：
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- Supplier Device Package：
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- Primary Attributes：
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- Condiciones seleccionadas:
Descubre los productos 12
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Operating Temperature | Package / Case | Supplier Device Package | Primary Attributes | RAM Size | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Operating Temperature | Package / Case | Supplier Device Package | Primary Attributes | RAM Size | |
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Xilinx Inc. |
60
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
XAZU2EG-1SFVA625I
|
-40°C ~ 100°C (TJ) | 625-BFBGA，FCBGA | 625-FCBGA (21x21) | Zynq®UltraScale+® FPGA，103K+ Logic Cells | 1.2MB | ||
|
|
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Xilinx Inc. |
60
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
XAZU2EG-1SFVC784I
|
-40°C ~ 100°C (TJ) | 784-BFBGA，FCBGA | 784-FCBGA (23x23) | Zynq®UltraScale+® FPGA，103K+ Logic Cells | 1.2MB | ||
|
|
|
Xilinx Inc. |
60
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
XAZU2EG-L1SFVA625I
|
-40°C ~ 100°C (TJ) | 625-BFBGA，FCBGA | 625-FCBGA (21x21) | Zynq®UltraScale+® FPGA，103K+ Logic Cells | 1.2MB | ||
|
|
|
Xilinx Inc. |
60
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
XAZU2EG-L1SFVC784I
|
-40°C ~ 100°C (TJ) | 784-BFBGA，FCBGA | 784-FCBGA (23x23) | Zynq®UltraScale+® FPGA，154K+ Logic Cells | 1.2MB | ||
|
|
|
Xilinx Inc. |
60
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
XAZU3EG-1SFVA625I
|
-40°C ~ 100°C (TJ) | 625-BFBGA，FCBGA | 625-FCBGA (21x21) | Zynq®UltraScale+® FPGA，154K+ Logic Cells | 1.8MB | ||
|
|
|
Xilinx Inc. |
60
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
XAZU3EG-1SFVC784I
|
-40°C ~ 100°C (TJ) | 784-BFBGA，FCBGA | 784-FCBGA (23x23) | Zynq®UltraScale+® FPGA，154K+ Logic Cells | 1.8MB | ||
|
|
|
Xilinx Inc. |
60
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
XAZU3EG-L1SFVA625I
|
-40°C ~ 100°C (TJ) | 625-BFBGA，FCBGA | 625-FCBGA (21x21) | Zynq®UltraScale+® FPGA，154K+ Logic Cells | 1.8MB | ||
|
|
|
Xilinx Inc. |
60
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
XAZU3EG-L1SFVC784I
|
-40°C ~ 100°C (TJ) | 784-BFBGA，FCBGA | 784-FCBGA (23x23) | Zynq®UltraScale+® FPGA，154K+ Logic Cells | 1.8MB | ||
|
|
|
Xilinx Inc. |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
XAZU2EG-1SFVA625Q
|
-40°C ~ 125°C (TJ) | 625-BFBGA，FCBGA | 625-FCBGA (21x21) | Zynq®UltraScale+® FPGA，103K+ Logic Cells | 1.2MB | ||
|
|
|
Xilinx Inc. |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
XAZU2EG-1SFVC784Q
|
-40°C ~ 125°C (TJ) | 784-BFBGA，FCBGA | 784-FCBGA (23x23) | Zynq®UltraScale+® FPGA，103K+ Logic Cells | 1.2MB | ||
|
|
|
Xilinx Inc. |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
XAZU3EG-1SFVA625Q
|
-40°C ~ 125°C (TJ) | 625-BFBGA，FCBGA | 625-FCBGA (21x21) | Zynq®UltraScale+® FPGA，154K+ Logic Cells | 1.8MB | ||
|
|
|
Xilinx Inc. |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
XAZU3EG-1SFVC784Q
|
-40°C ~ 125°C (TJ) | 784-BFBGA，FCBGA | 784-FCBGA (23x23) | Zynq®UltraScale+® FPGA，154K+ Logic Cells | 1.8MB |
