- Operating Temperature：
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- Package / Case：
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- Supplier Device Package：
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- Core Processor：
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- Number of Cores/Bus Width：
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- Display & Interface Controllers：
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- Condiciones seleccionadas:
Descubre los productos 96
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Operating Temperature | Package / Case | Supplier Device Package | Core Processor | Speed | Number of Cores/Bus Width | Display & Interface Controllers | Ethernet | USB | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Operating Temperature | Package / Case | Supplier Device Package | Core Processor | Speed | Number of Cores/Bus Width | Display & Interface Controllers | Ethernet | USB | |
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|
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NXP USA Inc. |
60
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
QORIQ 4XCPU 64-BIT ARM ARCH 1.
|
0°C ~ 105°C | 780-FBGA，FCBGA | 780-FCPBGA (23x23) | ARM® Cortex®-A53 | 1.6GHz | 4 Core，64-Bit | - | 1 GbE (7) or 10 GbE (1) & 1 GbE (5) | USB 3.0 (3) + PHY | ||
|
|
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NXP USA Inc. |
60
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
LS1043A R1.1 XTWE 1.6GHZ
|
-40°C ~ 105°C | 621-FBGA，FCBGA | 621-FCPBGA (21x21) | ARM® Cortex®-A53 | 1.4GHz | 4 Core，64-Bit | - | 1 GbE (7) or 10 GbE (1) & 1 GbE (5) | USB 3.0 (3) + PHY | ||
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|
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NXP USA Inc. |
84
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
LS1 32BIT ARM SOC 800MHZ DDR3/
|
0°C ~ 105°C | 525-FBGA，FCBGA | 525-FCPBGA (19x19) | ARM® Cortex®-A7 | 800MHz | 2 Core，32-Bit | 2D-ACE | GbE (3) | USB 3.0 (1) + PHY | ||
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|
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NXP USA Inc. |
77
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
LS1 32BIT ARM SOC 800MHZ DDR3/
|
0°C ~ 105°C | 525-FBGA，FCBGA | 525-FCPBGA (19x19) | ARM® Cortex®-A7 | 800MHz | 2 Core，32-Bit | 2D-ACE | GbE (3) | USB 3.0 (1) + PHY | ||
|
|
|
NXP USA Inc. |
84
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
LS1 32BIT ARM SOC 1GHZ DDR3/4
|
0°C ~ 105°C | 525-FBGA，FCBGA | 525-FCPBGA (19x19) | ARM® Cortex®-A7 | 1.0GHz | 2 Core，32-Bit | 2D-ACE | GbE (3) | USB 3.0 (1) + PHY | ||
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|
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NXP USA Inc. |
84
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
LS1 32BIT ARM SOC 1GHZ DDR3/4
|
0°C ~ 105°C | 525-FBGA，FCBGA | 525-FCPBGA (19x19) | ARM® Cortex®-A7 | 1.0GHz | 2 Core，32-Bit | 2D-ACE | GbE (3) | USB 3.0 (1) + PHY | ||
|
|
|
NXP USA Inc. |
84
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
LS1 32BIT ARM SOC 800MHZ DDR3/
|
-40°C ~ 105°C | 525-FBGA，FCBGA | 525-FCPBGA (19x19) | ARM® Cortex®-A7 | 800MHz | 2 Core，32-Bit | 2D-ACE | GbE (3) | USB 3.0 (1) + PHY | ||
|
|
|
NXP USA Inc. |
84
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
LS1 32BIT ARM SOC 800MHZ DDR3/
|
-40°C ~ 105°C | 525-FBGA，FCBGA | 525-FCPBGA (19x19) | ARM® Cortex®-A7 | 800MHz | 2 Core，32-Bit | 2D-ACE | GbE (3) | USB 3.0 (1) + PHY | ||
|
|
|
NXP USA Inc. |
64
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
LS1 32BIT ARM SOC 1GHZ DDR3/4
|
-40°C ~ 105°C | 525-FBGA，FCBGA | 525-FCPBGA (19x19) | ARM® Cortex®-A7 | 1.0GHz | 2 Core，32-Bit | 2D-ACE | GbE (3) | USB 3.0 (1) + PHY | ||
|
|
|
NXP USA Inc. |
68
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
LS1 32BIT ARM SOC 1GHZ DDR3/4
|
-40°C ~ 105°C | 525-FBGA，FCBGA | 525-FCPBGA (19x19) | ARM® Cortex®-A7 | 1.0GHz | 2 Core，32-Bit | 2D-ACE | GbE (3) | USB 3.0 (1) + PHY | ||
|
|
|
NXP USA Inc. |
84
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
LS1 32BIT ARM SOC 1.2GHZ DDR3/
|
-40°C ~ 105°C | 525-FBGA，FCBGA | 525-FCPBGA (19x19) | ARM® Cortex®-A7 | 1.2GHz | 2 Core，32-Bit | 2D-ACE | GbE (3) | USB 3.0 (1) + PHY | ||
|
|
|
NXP USA Inc. |
60
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
QORIQ 4XCPU 64-BIT ARM ARCH 1.
|
0°C ~ 105°C | 780-FBGA，FCBGA | 780-FCPBGA (23x23) | ARM® Cortex®-A53 | 1.0GHz | 4 Core，64-Bit | - | 1 GbE (7) or 10 GbE (1) & 1 GbE (5) | USB 3.0 (3) + PHY | ||
|
|
|
NXP USA Inc. |
60
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
QORIQ 4XCPU 64-BIT ARM ARCH 1.
|
0°C ~ 105°C | 621-FBGA，FCBGA | 621-FCPBGA (21x21) | ARM® Cortex®-A53 | 1.4GHz | 4 Core，64-Bit | - | 1 GbE (7) or 10 GbE (1) & 1 GbE (5) | USB 3.0 (3) + PHY | ||
|
|
|
NXP USA Inc. |
60
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
QORIQ 4XCPU 64-BIT ARM ARCH 1.
|
0°C ~ 105°C | 621-FBGA，FCBGA | 621-FCPBGA (21x21) | ARM® Cortex®-A53 | 1.4GHz | 4 Core，64-Bit | - | 1 GbE (7) or 10 GbE (1) & 1 GbE (5) | USB 3.0 (3) + PHY | ||
|
|
|
NXP USA Inc. |
60
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
QORIQ 4XCPU 64-BIT ARM ARCH 1.
|
0°C ~ 105°C | 621-FBGA，FCBGA | 621-FCPBGA (21x21) | ARM® Cortex®-A53 | 1.2GHz | 4 Core，64-Bit | - | 1 GbE (7) or 10 GbE (1) & 1 GbE (5) | USB 3.0 (3) + PHY | ||
|
|
|
NXP USA Inc. |
60
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
QORIQ 4XCPU 64-BIT ARM ARCH 1.
|
-40°C ~ 105°C | 621-FBGA，FCBGA | 621-FCPBGA (21x21) | ARM® Cortex®-A53 | 1.2GHz | 4 Core，64-Bit | - | 1 GbE (7) or 10 GbE (1) & 1 GbE (5) | USB 3.0 (3) + PHY | ||
|
|
|
NXP USA Inc. |
60
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
QORIQ 4XCPU 64-BIT ARM ARCH 1.
|
0°C ~ 105°C | 621-FBGA，FCBGA | 621-FCPBGA (21x21) | ARM® Cortex®-A53 | 1.6GHz | 4 Core，64-Bit | - | 1 GbE (7) or 10 GbE (1) & 1 GbE (5) | USB 3.0 (3) + PHY | ||
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|
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NXP USA Inc. |
Consulta
|
- |
-
|
MOQ: 84 MPQ: 1
|
LS1 32BIT ARM SOC 1.2GHZ DDR3/
|
0°C ~ 105°C | 525-FBGA，FCBGA | 525-FCPBGA (19x19) | ARM® Cortex®-A7 | 1.2GHz | 2 Core，32-Bit | 2D-ACE | GbE (3) | USB 3.0 (1) + PHY | ||
|
|
|
NXP USA Inc. |
Consulta
|
- |
-
|
MOQ: 84 MPQ: 1
|
LS1 32BIT ARM SOC 1.2GHZ DDR3/
|
0°C ~ 105°C | 525-FBGA，FCBGA | 525-FCPBGA (19x19) | ARM® Cortex®-A7 | 1.2GHz | 2 Core，32-Bit | 2D-ACE | GbE (3) | USB 3.0 (1) + PHY | ||
|
|
|
NXP USA Inc. |
Consulta
|
- |
-
|
MOQ: 84 MPQ: 1
|
LS1 32BIT ARM SOC 1.2GHZ DDR3/
|
-40°C ~ 105°C | 525-FBGA，FCBGA | 525-FCPBGA (19x19) | ARM® Cortex®-A7 | 1.2GHz | 2 Core，32-Bit | 2D-ACE | GbE (3) | USB 3.0 (1) + PHY |
