- Series：
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- Operating Temperature：
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- Package / Case：
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- Supplier Device Package：
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- Core Processor：
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- Voltage - I/O：
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- Speed：
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- Number of Cores/Bus Width：
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- RAM Controllers：
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- Display & Interface Controllers：
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- Ethernet：
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- USB：
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- Security Features：
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- Condiciones seleccionadas:
Descubre los productos 270
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Packaging | Series | Operating Temperature | Package / Case | Supplier Device Package | Core Processor | Voltage - I/O | Speed | Number of Cores/Bus Width | RAM Controllers | Graphics Acceleration | Display & Interface Controllers | Ethernet | USB | Security Features | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Packaging | Series | Operating Temperature | Package / Case | Supplier Device Package | Core Processor | Voltage - I/O | Speed | Number of Cores/Bus Width | RAM Controllers | Graphics Acceleration | Display & Interface Controllers | Ethernet | USB | Security Features | |
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Renesas Electronics America |
220
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3 dias |
-
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MOQ: 1 MPQ: 1
|
IC MCU 32BIT ROMLESS 176LFBGA
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Tray | RZ/A1L | -40°C ~ 85°C (TA) | 176-LFBGA | 176-LFBGA (8x8) | ARM® Cortex®-A9 | 1.2V，3.3V | 400MHz | 1 Core，32-Bit | SDRAM，SRAM | Yes | VDC | 10/100 Mbps | USB 2.0 (2) | - | ||
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|
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NXP USA Inc. |
265
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3 dias |
-
|
MOQ: 1 MPQ: 1
|
IC MPU I.MX6SX 800MHZ 400MAPBGA
|
Tray | i.MX6SX | -40°C ~ 105°C (TA) | 400-LFBGA | 400-MAPBGA (17x17) | ARM® Cortex®-A9，ARM® Cortex®-M4 | 1.8V，2.5V，2.8V，3.15V | 200MHz，800MHz | 2 Core，32-Bit | LPDDR2，LVDDR3，DDR3 | Yes | Keypad，LCD | 10/100/1000 Mbps (2) | USB 2.0 + PHY (1)，USB 2.0 OTG + PHY (2) | A-HAB，ARM TZ，CAAM，CSU，SNVS，System JTAG，TVDECODE | ||
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|
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NXP USA Inc. |
1,520
|
3 dias |
-
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MOQ: 1 MPQ: 1
|
IC MPU I.MX6SX 1GHZ 400MAPBGA
|
Tray | i.MX6SX | -20°C ~ 105°C (TJ) | 400-LFBGA | 400-MAPBGA (14x14) | ARM® Cortex®-A9，ARM® Cortex®-M4 | 1.8V，2.5V，2.8V，3.15V | 200MHz，1GHz | 2 Core，32-Bit | LPDDR2，LVDDR3，DDR3 | Yes | Keypad，LCD | 10/100/1000 Mbps (2) | USB 2.0 + PHY (1)，USB 2.0 OTG + PHY (2) | A-HAB，ARM TZ，CAAM，CSU，SNVS，System JTAG，TVDECODE | ||
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|
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NXP USA Inc. |
1,424
|
3 dias |
-
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MOQ: 1 MPQ: 1
|
IC MPU I.MX6SX 800MHZ 529MAPBGA
|
Tray | i.MX6SX | -40°C ~ 105°C (TA) | 529-LFBGA | 529-MAPBGA (19x19) | ARM® Cortex®-A9，ARM® Cortex®-M4 | 1.8V，2.5V，2.8V，3.15V | 200MHz，800MHz | 2 Core，32-Bit | LPDDR2，LVDDR3，DDR3 | Yes | Keypad，LCD，LVDS | 10/100/1000 Mbps (2) | USB 2.0 + PHY (1)，USB 2.0 OTG + PHY (2) | A-HAB，ARM TZ，CAAM，CSU，SNVS，System JTAG，TVDECODE | ||
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|
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NXP USA Inc. |
564
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
IC MPU I.MX6SX 800MHZ 529MAPBGA
|
Tray | i.MX6SX | -40°C ~ 125°C (TJ) | 529-LFBGA | 529-MAPBGA (19x19) | ARM® Cortex®-A9，ARM® Cortex®-M4 | 1.8V，2.5V，2.8V，3.15V | 200MHz，800MHz | 2 Core，32-Bit | LPDDR2，LVDDR3，DDR3 | Yes | Keypad，LCD，LVDS | 10/100/1000 Mbps (2) | USB 2.0 + PHY (1)，USB 2.0 OTG + PHY (2) | A-HAB，ARM TZ，CAAM，CSU，SNVS，System JTAG，TVDECODE | ||
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|
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Renesas Electronics America |
164
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT ROMLESS 176LFQFP
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Tray | RZ/A1L | -40°C ~ 85°C (TA) | 176-LQFP | 176-LFQFP (24x24) | ARM® Cortex®-A9 | 1.2V，3.3V | 400MHz | 1 Core，32-Bit | SDRAM，SRAM | Yes | VDC | 10/100 Mbps | USB 2.0 (2) | - | ||
|
|
|
NXP USA Inc. |
166
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
IC MPU I.MX6SX 1GHZ 529MAPBGA
|
Tray | i.MX6SX | -20°C ~ 105°C (TJ) | 529-LFBGA | 529-MAPBGA (19x19) | ARM® Cortex®-A9，ARM® Cortex®-M4 | 1.8V，2.5V，2.8V，3.15V | 200MHz，1GHz | 2 Core，32-Bit | LPDDR2，LVDDR3，DDR3 | Yes | Keypad，LCD，LVDS | 10/100/1000 Mbps (2) | USB 2.0 + PHY (1)，USB 2.0 OTG + PHY (2) | A-HAB，ARM TZ，CAAM，CSU，SNVS，System JTAG，TVDECODE | ||
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|
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NXP USA Inc. |
155
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
IC MPU I.MX6SX 1GHZ 400MAPBGA
|
Tray | i.MX6SX | -20°C ~ 105°C (TJ) | 400-LFBGA | 400-MAPBGA (17x17) | ARM® Cortex®-A9，ARM® Cortex®-M4 | 1.8V，2.5V，2.8V，3.15V | 200MHz，1GHz | 2 Core，32-Bit | LPDDR2，LVDDR3，DDR3 | Yes | Keypad，LCD | 10/100/1000 Mbps (2) | USB 2.0 + PHY (1)，USB 2.0 OTG + PHY (2) | A-HAB，ARM TZ，CAAM，CSU，SNVS，System JTAG，TVDECODE | ||
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|
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NXP USA Inc. |
120
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
IC MPU I.MX6SX 800MHZ 400MAPBGA
|
Tray | i.MX6SX | -40°C ~ 125°C (TJ) | 400-LFBGA | 400-MAPBGA (17x17) | ARM® Cortex®-A9，ARM® Cortex®-M4 | 1.8V，2.5V，2.8V，3.15V | 200MHz，800MHz | 2 Core，32-Bit | LPDDR2，LVDDR3，DDR3 | No | Keypad，LCD | 10/100/1000 Mbps (2) | USB 2.0 + PHY (1)，USB 2.0 OTG + PHY (2) | A-HAB，ARM TZ，CAAM，CSU，SNVS，System JTAG，TVDECODE | ||
|
|
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NXP USA Inc. |
171
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
IC MPU I.MX6SX 800MHZ 400MAPBGA
|
Tray | i.MX6SX | -40°C ~ 125°C (TJ) | 400-LFBGA | 400-MAPBGA (17x17) | ARM® Cortex®-A9，ARM® Cortex®-M4 | 1.8V，2.5V，2.8V，3.15V | 200MHz，800MHz | 2 Core，32-Bit | LPDDR2，LVDDR3，DDR3 | Yes | Keypad，LCD | 10/100/1000 Mbps (2) | USB 2.0 + PHY (1)，USB 2.0 OTG + PHY (2) | A-HAB，ARM TZ，CAAM，CSU，SNVS，System JTAG，TVDECODE | ||
|
|
|
NXP USA Inc. |
222
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
IC MPU I.MX6SX 800MHZ 400MAPBGA
|
Tray | i.MX6SX | -40°C ~ 105°C (TA) | 400-LFBGA | 400-MAPBGA (14x14) | ARM® Cortex®-A9，ARM® Cortex®-M4 | 1.8V，2.5V，2.8V，3.15V | 200MHz，800MHz | 2 Core，32-Bit | LPDDR2，LVDDR3，DDR3 | No | Keypad，LCD | 10/100/1000 Mbps (2) | USB 2.0 + PHY (1)，USB 2.0 OTG + PHY (2) | A-HAB，ARM TZ，CAAM，CSU，SNVS，System JTAG，TVDECODE | ||
|
|
|
NXP USA Inc. |
126
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
IC MPU I.MX6SX 800MHZ 400MAPBGA
|
Tray | i.MX6SX | -40°C ~ 125°C (TJ) | 400-LFBGA | 400-MAPBGA (14x14) | ARM® Cortex®-A9，ARM® Cortex®-M4 | 1.8V，2.5V，2.8V，3.15V | 200MHz，800MHz | 2 Core，32-Bit | LPDDR2，LVDDR3，DDR3 | No | Keypad，LCD | 10/100/1000 Mbps (2) | USB 2.0 + PHY (1)，USB 2.0 OTG + PHY (2) | A-HAB，ARM TZ，CAAM，CSU，SNVS，System JTAG，TVDECODE | ||
|
|
|
Renesas Electronics America |
250
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
RZ/A1H 400MHZ 10MB BGA324
|
Tray | RZ/A1H | -40°C ~ 85°C (TA) | 324-BGA | 324-FBGA (19x19) | ARM® Cortex®-A9 | 1.2V，3.3V | 400MHz | 1 Core，32-Bit | SDRAM，SRAM | Yes | DVD，VDC | 10/100 Mbps (1)，100 Mbps (1) | USB 2.0 (2) | - | ||
|
|
|
NXP USA Inc. |
223
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
I.MX 32-BIT MPU ARM CORTEX-A7 C
|
Tray | i.MX6 | 0°C ~ 95°C (TJ) | 272-LFBGA | 272-MAPBGA (9x9) | ARM® Cortex®-A7 | 1.8V，2.8V，3.3V | 528MHz | 1 Core，32-Bit | LPDDR2，DDR3，DDR3L | No | Electrophoretic，LCD | 10/100 Mbps (2) | USB 2.0 OTG + PHY (2) | A-HAB，ARM TZ，CSU，SJC，SNVS | ||
|
|
|
NXP USA Inc. |
241
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
528MHZETHERNET X1 USB OTG X1
|
Tray | i.MX6 | 0°C ~ 95°C (TJ) | 272-LFBGA | 272-MAPBGA (9x9) | ARM® Cortex®-A7 | 1.8V，2.8V，3.3V | 528MHz | 1 Core，32-Bit | LPDDR2，DDR3，DDR3L | No | Electrophoretic，LCD | 10/100 Mbps (1) | USB 2.0 OTG + PHY (2) | A-HAB，ARM TZ，CSU，SJC，SNVS | ||
|
|
|
NXP USA Inc. |
152
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
I.MX6ULL ROM PERF ENHAN
|
Tray | i.MX6 | 0°C ~ 95°C (TJ) | 289-LFBGA | 289-MAPBGA (14x14) | ARM® Cortex®-A7 | 1.8V，2.8V，3.3V | 900MHz | 1 Core，32-Bit | LPDDR2，DDR3，DDR3L | No | Electrophoretic，LCD | 10/100 Mbps (2) | USB 2.0 OTG + PHY (2) | A-HAB，ARM TZ，CSU，SJC，SNVS | ||
|
|
|
NXP USA Inc. |
152
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
NO EPDC，1 ETH，NO CAN，1 OTG 1
|
Tray | i.MX7S | -20°C ~ 105°C (TJ) | 488-TFBGA | 488-FBGA (12x12) | ARM® Cortex®-A7，ARM® Cortex®-M4 | 1.8V，3.3V | 800MHz | 1 Core，32-Bit | LPDDR2，LPDDR3，DDR3，DDR3L | No | Keypad，LCD，MIPI | 10/100/1000 Mbps (1) | USB 2.0 + PHY (1)，USB 2.0 OTG + PHY (1) | A-HAB，ARM TZ，CAAM，CSU，SJC，SNVS | ||
|
|
|
NXP USA Inc. |
142
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
NO EPDC，2 ETH，NO CAN，2 OTG 1
|
Tray | i.MX7D | 0°C ~ 95°C (TJ) | 488-TFBGA | 488-FBGA (12x12) | ARM® Cortex®-A7，ARM® Cortex®-M4 | 1.8V，3.3V | 1.0GHz | 2 Core，32-Bit | LPDDR2，LPDDR3，DDR3，DDR3L | No | Keypad，LCD，MIPI | 10/100/1000 Mbps (2) | USB 2.0 + PHY (1)，USB 2.0 OTG + PHY (2) | A-HAB，ARM TZ，CAAM，CSU，SJC，SNVS | ||
|
|
|
NXP USA Inc. |
672
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
NO EPDC，1 ETH，CAN，1 OTG 1 HSI
|
Tray | i.MX7S | -20°C ~ 105°C (TJ) | 541-LFBGA | 541-MAPBGA (19x19) | ARM® Cortex®-A7，ARM® Cortex®-M4 | 1.8V，3.3V | 800MHz | 1 Core，32-Bit | LPDDR2，LPDDR3，DDR3，DDR3L | No | Keypad，LCD，MIPI | 10/100/1000 Mbps (1) | USB 2.0 + PHY (1)，USB 2.0 OTG + PHY (1) | A-HAB，ARM TZ，CAAM，CSU，SJC，SNVS | ||
|
|
|
NXP USA Inc. |
128
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT ROMLESS 364MAPBGA
|
Tray | Vybrid，VF5xx | -40°C ~ 85°C (TA) | 364-LFBGA | 364-LFBGA (17x17) | ARM® Cortex®-A5 | 3.3V | 500MHz | 1 Core，32-Bit | LPDDR2，DDR3，DRAM | Yes | DCU，GPU，LCD，VideoADC，VIU | 10/100 Mbps (2) | USB 2.0 OTG + PHY (1) | - |
