- Operating Temperature:
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- Package / Case:
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- Supplier Device Package:
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- Speed:
-
- Number of Cores/Bus Width:
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- Condiciones seleccionadas:
Descubre los productos 21
La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Operating Temperature | Package / Case | Supplier Device Package | Speed | Number of Cores/Bus Width | ||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Operating Temperature | Package / Case | Supplier Device Package | Speed | Number of Cores/Bus Width | ||
NXP USA Inc. |
27
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
IC MPU Q OR IQ 800MHZ 689TEBGA
|
-40°C ~ 105°C (TA) | 689-BBGA Exposed Pad | 689-TEPBGA II (31x31) | 800MHz | 1 Core,32-Bit | ||||
NXP USA Inc. |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
IC MPU Q OR IQ 800MHZ 689TEBGA
|
-40°C ~ 105°C (TA) | 689-BBGA Exposed Pad | 689-TEPBGA II (31x31) | 800MHz | 2 Core,32-Bit | ||||
NXP USA Inc. |
Consulta
|
- |
-
|
MOQ: 27 MPQ: 1
|
IC MPU Q OR IQ 800MHZ 689TEBGA
|
0°C ~ 125°C (TA) | 689-BBGA Exposed Pad | 689-TEPBGA II (31x31) | 800MHz | 1 Core,32-Bit | ||||
NXP USA Inc. |
Consulta
|
- |
-
|
MOQ: 60 MPQ: 1
|
IC MPU Q OR IQ 667MHZ 561TEBGA1
|
0°C ~ 125°C (TA) | 561-FBGA | 561-TEPBGA1 (23x23) | 667MHz | 2 Core,32-Bit | ||||
NXP USA Inc. |
Consulta
|
- |
-
|
MOQ: 27 MPQ: 1
|
IC MPU Q OR IQ 800MHZ 689TEBGA
|
0°C ~ 125°C (TA) | 689-BBGA Exposed Pad | 689-TEPBGA II (31x31) | 800MHz | 2 Core,32-Bit | ||||
NXP USA Inc. |
Consulta
|
- |
-
|
MOQ: 135 MPQ: 1
|
IC MPU Q OR IQ 800MHZ 689TEBGA
|
0°C ~ 125°C (TA) | 689-BBGA Exposed Pad | 689-TEPBGA II (31x31) | 800MHz | 1 Core,32-Bit | ||||
NXP USA Inc. |
Consulta
|
- |
-
|
MOQ: 27 MPQ: 1
|
IC MPU Q OR IQ 800MHZ 689TEBGA
|
-40°C ~ 105°C (TA) | 689-BBGA Exposed Pad | 689-TEPBGA II (31x31) | 800MHz | 2 Core,32-Bit | ||||
NXP USA Inc. |
Consulta
|
- |
-
|
MOQ: 60 MPQ: 1
|
IC MPU Q OR IQ 667MHZ 561TEBGA1
|
-40°C ~ 125°C (TA) | 561-FBGA | 561-TEPBGA1 (23x23) | 667MHz | 1 Core,32-Bit | ||||
NXP USA Inc. |
Consulta
|
- |
-
|
MOQ: 27 MPQ: 1
|
IC MPU Q OR IQ 800MHZ 689TEBGA
|
-40°C ~ 105°C (TA) | 689-BBGA Exposed Pad | 689-TEPBGA II (31x31) | 800MHz | 2 Core,32-Bit | ||||
NXP USA Inc. |
Consulta
|
- |
-
|
MOQ: 27 MPQ: 1
|
IC MPU Q OR IQ 800MHZ 689TEBGA
|
-40°C ~ 105°C (TA) | 689-BBGA Exposed Pad | 689-TEPBGA II (31x31) | 800MHz | 1 Core,32-Bit | ||||
NXP USA Inc. |
Consulta
|
- |
-
|
MOQ: 27 MPQ: 1
|
IC MPU Q OR IQ 800MHZ 689TEBGA
|
0°C ~ 125°C (TA) | 689-BBGA Exposed Pad | 689-TEPBGA II (31x31) | 800MHz | 2 Core,32-Bit | ||||
NXP USA Inc. |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
IC MPU Q OR IQ 800MHZ 689TEBGA
|
0°C ~ 125°C (TA) | 689-BBGA Exposed Pad | 689-TEPBGA II (31x31) | 800MHz | 1 Core,32-Bit | ||||
NXP USA Inc. |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
IC MPU Q OR IQ 800MHZ 689TEBGA
|
-40°C ~ 105°C (TA) | 689-BBGA Exposed Pad | 689-TEPBGA II (31x31) | 800MHz | 1 Core,32-Bit | ||||
NXP USA Inc. |
Consulta
|
- |
-
|
MOQ: 83 MPQ: 1
|
IC MPU Q OR IQ 667MHZ 561TEBGA1
|
0°C ~ 125°C (TA) | 561-FBGA | 561-TEPBGA1 (23x23) | 667MHz | 1 Core,32-Bit | ||||
NXP USA Inc. |
Consulta
|
- |
-
|
MOQ: 77 MPQ: 1
|
IC MPU Q OR IQ 667MHZ 561TEBGA1
|
0°C ~ 125°C (TA) | 561-FBGA | 561-TEPBGA1 (23x23) | 667MHz | 1 Core,32-Bit | ||||
NXP USA Inc. |
Consulta
|
- |
-
|
MOQ: 72 MPQ: 1
|
IC MPU Q OR IQ 667MHZ 561TEBGA1
|
-40°C ~ 125°C (TA) | 561-FBGA | 561-TEPBGA1 (23x23) | 667MHz | 1 Core,32-Bit | ||||
NXP USA Inc. |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
IC MPU Q OR IQ 667MHZ 561TEBGA1
|
-40°C ~ 125°C (TA) | 561-FBGA | 561-TEPBGA1 (23x23) | 667MHz | 1 Core,32-Bit | ||||
NXP USA Inc. |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
IC MPU Q OR IQ 800MHZ 689TEBGA
|
0°C ~ 125°C (TA) | 689-BBGA Exposed Pad | 689-TEPBGA II (31x31) | 800MHz | 2 Core,32-Bit | ||||
NXP USA Inc. |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
IC MPU Q OR IQ 667MHZ 561TEBGA1
|
0°C ~ 125°C (TA) | 561-FBGA | 561-TEPBGA1 (23x23) | 667MHz | 2 Core,32-Bit | ||||
NXP USA Inc. |
Consulta
|
- |
-
|
MOQ: 1 MPQ: 1
|
IC MPU Q OR IQ 667MHZ 561TEBGA1
|
-40°C ~ 125°C (TA) | 561-FBGA | 561-TEPBGA1 (23x23) | 667MHz | 2 Core,32-Bit |