- Series：
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- Operating Temperature：
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- Package / Case：
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- Supplier Device Package：
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- Core Processor：
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- Voltage - I/O：
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- Co-Processors/DSP：
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- Condiciones seleccionadas:
Descubre los productos 7
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Operating Temperature | Package / Case | Supplier Device Package | Core Processor | Voltage - I/O | Co-Processors/DSP | |
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La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Series | Operating Temperature | Package / Case | Supplier Device Package | Core Processor | Voltage - I/O | Co-Processors/DSP | |
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NXP USA Inc. |
Consulta
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-
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MOQ: 44 MPQ: 1
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IC MPU MPC74XX 1.167GHZ 360BGA
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MPC74xx | 0°C ~ 105°C (TA) | 360-BCBGA，FCCBGA | 360-FCCBGA (25x25) | PowerPC G4 | 1.8V，2.5V | Multimedia; SIMD | ||
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NXP USA Inc. |
Consulta
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- |
-
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MOQ: 44 MPQ: 1
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IC MPU MPC74XX 1.167GHZ 360BGA
|
MPC74xx | -40°C ~ 105°C (TA) | 360-BCBGA，FCCBGA | 360-FCCBGA (25x25) | PowerPC G4 | 1.8V，2.5V | Multimedia; SIMD | ||
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NXP USA Inc. |
Consulta
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- |
-
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MOQ: 44 MPQ: 1
|
IC MPU MPC74XX 1.167GHZ 360LGA
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MPC74xx | 0°C ~ 105°C (TA) | 360-CLGA，FCCLGA | 360-FCCLGA (25x25) | PowerPC G4 | 1.8V，2.5V | Multimedia; SIMD | ||
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NXP USA Inc. |
Consulta
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- |
-
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MOQ: 2 MPQ: 1
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IC MPU MPC74XX 1.167GHZ 360BGA
|
MPC74xx | 0°C ~ 105°C (TA) | 360-BCBGA，FCCBGA | 360-FCCBGA (25x25) | PowerPC G4 | 1.8V，2.5V | Multimedia; SIMD | ||
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NXP USA Inc. |
Consulta
|
- |
-
|
MOQ: 44 MPQ: 1
|
IC MPU MPC74XX 1.167GHZ 360BGA
|
MPC74xx | 0°C ~ 105°C (TA) | 360-BCBGA，FCCBGA | 360-FCCBGA (25x25) | PowerPC G4 | 1.8V，2.5V | Multimedia; SIMD | ||
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Microchip Technology |
Consulta
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- |
-
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MOQ: 44 MPQ: 1
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IC MPU POWERPC 1.167GHZ 360CBGA
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- | -40°C ~ 110°C (TJ) | 360-BCBGA | 360-CBGA (25x25) | PowerPC | 1.1V，1.3V | - | ||
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NXP USA Inc. |
Consulta
|
- |
-
|
MOQ: 2 MPQ: 1
|
IC MPU MPC74XX 1.167GHZ 360LGA
|
MPC74xx | 0°C ~ 105°C (TA) | 360-CLGA，FCCLGA | 360-FCCLGA (25x25) | PowerPC G4 | 1.8V，2.5V | Multimedia; SIMD |
