- Packaging:
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- Series:
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- Operating Temperature:
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- Package / Case:
-
- Supplier Device Package:
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- Voltage - I/O:
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- Co-Processors/DSP:
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- RAM Controllers:
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- Security Features:
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- Condiciones seleccionadas:
Descubre los productos 134
La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Packaging | Series | Operating Temperature | Package / Case | Supplier Device Package | Voltage - I/O | Speed | Co-Processors/DSP | RAM Controllers | Ethernet | USB | Security Features | ||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Packaging | Series | Operating Temperature | Package / Case | Supplier Device Package | Voltage - I/O | Speed | Co-Processors/DSP | RAM Controllers | Ethernet | USB | Security Features | ||
NXP USA Inc. |
734
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC82XX 400MHZ 516BGA
|
Tray | MPC82xx | -40°C ~ 105°C (TA) | 516-BBGA | 516-FPBGA (27x27) | 3.3V | 400MHz | Communications; RISC CPM | DRAM,SDRAM | 10/100 Mbps (2) | USB 2.0 (1) | - | ||||
NXP USA Inc. |
440
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC82XX 266MHZ 516BGA
|
Tray | MPC82xx | -40°C ~ 105°C (TA) | 516-BBGA | 516-FPBGA (27x27) | 3.3V | 266MHz | Communications; RISC CPM | DRAM,SDRAM | 10/100 Mbps (3) | USB 2.0 (1) | - | ||||
NXP USA Inc. |
305
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC82XX 450MHZ 480TBGA
|
Tray | MPC82xx | 0°C ~ 105°C (TA) | 480-LBGA Exposed Pad | 480-TBGA (37.5x37.5) | 3.3V | 450MHz | Communications; RISC CPM | DRAM,SDRAM | 10/100 Mbps (3) | USB 2.0 (1) | - | ||||
NXP USA Inc. |
368
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC82XX 450MHZ 480TBGA
|
Tray | MPC82xx | -40°C ~ 105°C (TA) | 480-LBGA Exposed Pad | 480-TBGA (37.5x37.5) | 3.3V | 450MHz | Communications; RISC CPM | DRAM,SDRAM | 10/100 Mbps (3) | USB 2.0 (1) | - | ||||
NXP USA Inc. |
98
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC82XX 450MHZ 480TBGA
|
Tray | MPC82xx | -40°C ~ 105°C (TA) | 480-LBGA Exposed Pad | 480-TBGA (37.5x37.5) | 3.3V | 450MHz | Communications; RISC CPM | DRAM,SDRAM | 10/100 Mbps (3) | USB 2.0 (1) | - | ||||
NXP USA Inc. |
339
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC52XX 400MHZ 272BGA
|
Tray | MPC52xx | -40°C ~ 85°C (TA) | 272-BBGA | 272-PBGA (27x27) | 2.5V,3.3V | 400MHz | - | DDR,SDRAM | 10/100 Mbps (1) | USB 1.1 (2) | - | ||||
NXP USA Inc. |
40
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC82XX 266MHZ 516BGA
|
Tray | MPC82xx | 0°C ~ 105°C (TA) | 516-BBGA | 516-FPBGA (27x27) | 3.3V | 266MHz | Communications; RISC CPM | DRAM,SDRAM | 10/100 Mbps (3) | USB 2.0 (1) | - | ||||
NXP USA Inc. |
79
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC82XX 333MHZ 480TBGA
|
Tray | MPC82xx | -40°C ~ 105°C (TA) | 480-LBGA Exposed Pad | 480-TBGA (37.5x37.5) | 3.3V | 333MHz | Communications; RISC CPM | DRAM,SDRAM | 10/100 Mbps (3) | USB 2.0 (1) | - | ||||
NXP USA Inc. |
122
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC82XX 266MHZ 516BGA
|
Tray | MPC82xx | -40°C ~ 105°C (TA) | 516-BBGA | 516-FPBGA (27x27) | 3.3V | 266MHz | Communications; RISC CPM | DRAM,SDRAM | 10/100 Mbps (2) | USB 2.0 (1) | - | ||||
NXP USA Inc. |
102
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC82XX 266MHZ 516BGA
|
Tray | MPC82xx | -40°C ~ 105°C (TA) | 516-BBGA | 516-FPBGA (27x27) | 3.3V | 266MHz | Communications; RISC CPM,Security; SEC | DRAM,SDRAM | 10/100 Mbps (2) | USB 2.0 (1) | Cryptography,Random Number Generator | ||||
NXP USA Inc. |
101
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC82XX 400MHZ 516BGA
|
Tray | MPC82xx | -40°C ~ 105°C (TA) | 516-BBGA | 516-FPBGA (27x27) | 3.3V | 400MHz | Communications; RISC CPM,Security; SEC | DRAM,SDRAM | 10/100 Mbps (2) | USB 2.0 (1) | Cryptography,Random Number Generator | ||||
NXP USA Inc. |
298
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC52XX 400MHZ 272BGA
|
Tray | MPC52xx | 0°C ~ 70°C (TA) | 272-BBGA | 272-PBGA (27x27) | 2.5V,3.3V | 400MHz | - | DDR,SDRAM | 10/100 Mbps (1) | USB 1.1 (2) | - | ||||
NXP USA Inc. |
40
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC82XX 266MHZ 516BGA
|
Tray | MPC82xx | 0°C ~ 105°C (TA) | 516-BBGA | 516-FPBGA (27x27) | 3.3V | 266MHz | Communications; RISC CPM | DRAM,SDRAM | 10/100 Mbps (3) | USB 2.0 (1) | - | ||||
NXP USA Inc. |
29
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC82XX 333MHZ 480TBGA
|
Tray | MPC82xx | 0°C ~ 105°C (TA) | 480-LBGA Exposed Pad | 480-TBGA (37.5x37.5) | 3.3V | 333MHz | Communications; RISC CPM | DRAM,SDRAM | 10/100 Mbps (3) | USB 2.0 (1) | - | ||||
NXP USA Inc. |
74
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC82XX 400MHZ 516BGA
|
Tray | MPC82xx | 0°C ~ 105°C (TA) | 516-BBGA | 516-FPBGA (27x27) | 3.3V | 400MHz | Communications; RISC CPM | DRAM,SDRAM | 10/100 Mbps (2) | USB 2.0 (1) | - | ||||
NXP USA Inc. |
74
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC82XX 400MHZ 516BGA
|
Tray | MPC82xx | 0°C ~ 105°C (TA) | 516-BBGA | 516-FPBGA (27x27) | 3.3V | 400MHz | Communications; RISC CPM | DRAM,SDRAM | 10/100 Mbps (2) | USB 2.0 (1) | - | ||||
NXP USA Inc. |
19
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC82XX 450MHZ 480TBGA
|
Tray | MPC82xx | 0°C ~ 105°C (TA) | 480-LBGA Exposed Pad | 480-TBGA (37.5x37.5) | 3.3V | 450MHz | Communications; RISC CPM | DRAM,SDRAM | 10/100 Mbps (3) | USB 2.0 (1) | - | ||||
NXP USA Inc. |
15
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC82XX 450MHZ 480TBGA
|
Tray | MPC82xx | 0°C ~ 105°C (TA) | 480-LBGA Exposed Pad | 480-TBGA (37.5x37.5) | 3.3V | 450MHz | Communications; RISC CPM | DRAM,SDRAM | 10/100 Mbps (3) | USB 2.0 (1) | - | ||||
NXP USA Inc. |
3
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC82XX 450MHZ 480TBGA
|
Tray | MPC82xx | 0°C ~ 105°C (TA) | 480-LBGA Exposed Pad | 480-TBGA (37.5x37.5) | 3.3V | 450MHz | Communications; RISC CPM | DRAM,SDRAM | 10/100 Mbps (3) | USB 2.0 (1) | - | ||||
NXP USA Inc. |
5
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC82XX 450MHZ 480TBGA
|
Tray | MPC82xx | -40°C ~ 105°C (TA) | 480-LBGA Exposed Pad | 480-TBGA (37.5x37.5) | 3.3V | 450MHz | Communications; RISC CPM | DRAM,SDRAM | 10/100 Mbps (3) | USB 2.0 (1) | - |