- Packaging:
-
- Series:
-
- Operating Temperature:
-
- Supplier Device Package:
-
- Core Processor:
-
- Voltage - I/O:
-
- Number of Cores/Bus Width:
-
- Co-Processors/DSP:
-
- RAM Controllers:
-
- Display & Interface Controllers:
-
- Ethernet:
-
- Condiciones seleccionadas:
Descubre los productos 26
La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Packaging | Series | Operating Temperature | Supplier Device Package | Core Processor | Voltage - I/O | Speed | Number of Cores/Bus Width | Co-Processors/DSP | RAM Controllers | Graphics Acceleration | Display & Interface Controllers | Ethernet | USB | Security Features | ||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
La imagen | Número de pieza | Fabricante | Cantidad | Plazo de entrega | Precio unitario | Comprar | Descripción | Packaging | Series | Operating Temperature | Supplier Device Package | Core Processor | Voltage - I/O | Speed | Number of Cores/Bus Width | Co-Processors/DSP | RAM Controllers | Graphics Acceleration | Display & Interface Controllers | Ethernet | USB | Security Features | ||
NXP USA Inc. |
1,424
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
IC MPU I.MX6SX 800MHZ 529MAPBGA
|
Tray | i.MX6SX | -40°C ~ 105°C (TA) | 529-MAPBGA (19x19) | ARM® Cortex®-A9,ARM® Cortex®-M4 | 1.8V,2.5V,2.8V,3.15V | 200MHz,800MHz | 2 Core,32-Bit | Multimedia; NEON® MPE | LPDDR2,LVDDR3,DDR3 | Yes | Keypad,LCD,LVDS | 10/100/1000 Mbps (2) | USB 2.0 + PHY (1),USB 2.0 OTG + PHY (2) | A-HAB,ARM TZ,CAAM,CSU,SNVS,System JTAG,TVDECODE | ||||
NXP USA Inc. |
564
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
IC MPU I.MX6SX 800MHZ 529MAPBGA
|
Tray | i.MX6SX | -40°C ~ 125°C (TJ) | 529-MAPBGA (19x19) | ARM® Cortex®-A9,ARM® Cortex®-M4 | 1.8V,2.5V,2.8V,3.15V | 200MHz,800MHz | 2 Core,32-Bit | Multimedia; NEON® MPE | LPDDR2,LVDDR3,DDR3 | Yes | Keypad,LCD,LVDS | 10/100/1000 Mbps (2) | USB 2.0 + PHY (1),USB 2.0 OTG + PHY (2) | A-HAB,ARM TZ,CAAM,CSU,SNVS,System JTAG,TVDECODE | ||||
NXP USA Inc. |
166
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
IC MPU I.MX6SX 1GHZ 529MAPBGA
|
Tray | i.MX6SX | -20°C ~ 105°C (TJ) | 529-MAPBGA (19x19) | ARM® Cortex®-A9,ARM® Cortex®-M4 | 1.8V,2.5V,2.8V,3.15V | 200MHz,1GHz | 2 Core,32-Bit | Multimedia; NEON® MPE | LPDDR2,LVDDR3,DDR3 | Yes | Keypad,LCD,LVDS | 10/100/1000 Mbps (2) | USB 2.0 + PHY (1),USB 2.0 OTG + PHY (2) | A-HAB,ARM TZ,CAAM,CSU,SNVS,System JTAG,TVDECODE | ||||
NXP USA Inc. |
420
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
IC MPU I.MX51 800MHZ 529BGA
|
Tray | i.MX51 | -20°C ~ 85°C (TC) | 529-BGA (19x19) | ARM® Cortex®-A8 | 1.2V,1.875V,2.775V,3.0V | 800MHz | 1 Core,32-Bit | Multimedia; NEON® SIMD | LPDDR,DDR2 | Yes | Keypad,LCD | 10/100 Mbps (1) | USB 2.0 (3),USB 2.0 + PHY (1) | ARM TZ,Boot Security,Cryptography,RTIC,Secure Fusebox,Secure JTAG,Secure Memory,Secure RTC | ||||
NXP USA Inc. |
161
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
IC MPU I.MX51 800MHZ 529BGA
|
Tray | i.MX51 | -20°C ~ 85°C (TC) | 529-BGA (19x19) | ARM® Cortex®-A8 | 1.2V,1.875V,2.775V,3.0V | 800MHz | 1 Core,32-Bit | Multimedia; NEON® SIMD | LPDDR,DDR2 | No | Keypad,LCD | 10/100 Mbps (1) | USB 2.0 (3),USB 2.0 + PHY (1) | ARM TZ,Boot Security,Cryptography,RTIC,Secure Fusebox,Secure JTAG,Secure Memory,Secure RTC | ||||
NXP USA Inc. |
420
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
IC MPU I.MX51 600MHZ 529BGA
|
Tray | i.MX51 | -40°C ~ 95°C (TC) | 529-BGA (19x19) | ARM® Cortex®-A8 | 1.2V,1.875V,2.775V,3.0V | 600MHz | 1 Core,32-Bit | Multimedia; NEON® SIMD | LPDDR,DDR2 | No | Keypad,LCD | 10/100 Mbps (1) | USB 2.0 (3),USB 2.0 + PHY (1) | ARM TZ,Boot Security,Cryptography,RTIC,Secure Fusebox,Secure JTAG,Secure Memory,Secure RTC | ||||
NXP USA Inc. |
39
|
3 dias |
-
|
MOQ: 1 MPQ: 1
|
IC MPU I.MX51 600MHZ 529BGA
|
Tray | i.MX51 | -40°C ~ 95°C (TC) | 529-BGA (19x19) | ARM® Cortex®-A8 | 1.2V,1.875V,2.775V,3.0V | 600MHz | 1 Core,32-Bit | Multimedia; NEON® SIMD | LPDDR,DDR2 | No | Keypad,LCD | 10/100 Mbps (1) | USB 2.0 (3),USB 2.0 + PHY (1) | ARM TZ,Boot Security,Cryptography,RTIC,Secure Fusebox,Secure JTAG,Secure Memory,Secure RTC | ||||
NXP USA Inc. |
Consulta
|
- |
-
|
MOQ: 750 MPQ: 1
|
IC MPU I.MX51 800MHZ 529BGA
|
Tape & Reel (TR) | i.MX51 | -20°C ~ 85°C (TC) | 529-BGA (19x19) | ARM® Cortex®-A8 | 1.2V,1.875V,2.775V,3.0V | 800MHz | 1 Core,32-Bit | Multimedia; NEON® SIMD | LPDDR,DDR2 | Yes | Keypad,LCD | 10/100 Mbps (1) | USB 2.0 (3),USB 2.0 + PHY (1) | ARM TZ,Boot Security,Cryptography,RTIC,Secure Fusebox,Secure JTAG,Secure Memory,Secure RTC | ||||
NXP USA Inc. |
Consulta
|
- |
-
|
MOQ: 420 MPQ: 1
|
IC MPU I.MX51 800MHZ 529BGA
|
Tray | i.MX51 | -20°C ~ 85°C (TC) | 529-BGA (19x19) | ARM® Cortex®-A8 | 1.2V,1.875V,2.775V,3.0V | 800MHz | 1 Core,32-Bit | Multimedia; NEON® SIMD | LPDDR,DDR2 | No | Keypad,LCD | 10/100 Mbps (1) | USB 2.0 (3),USB 2.0 + PHY (1) | ARM TZ,Boot Security,Cryptography,RTIC,Secure Fusebox,Secure JTAG,Secure Memory,Secure RTC | ||||
NXP USA Inc. |
Consulta
|
- |
-
|
MOQ: 750 MPQ: 1
|
IC MPU I.MX51 600MHZ 529BGA
|
Tape & Reel (TR) | i.MX51 | -40°C ~ 95°C (TC) | 529-BGA (19x19) | ARM® Cortex®-A8 | 1.2V,1.875V,2.775V,3.0V | 600MHz | 1 Core,32-Bit | Multimedia; NEON® SIMD | LPDDR,DDR2 | No | Keypad,LCD | 10/100 Mbps (1) | USB 2.0 (3),USB 2.0 + PHY (1) | ARM TZ,Boot Security,Cryptography,RTIC,Secure Fusebox,Secure JTAG,Secure Memory,Secure RTC | ||||
NXP USA Inc. |
Consulta
|
- |
-
|
MOQ: 420 MPQ: 1
|
IC MPU I.MX51 600MHZ 529BGA
|
Tray | i.MX51 | -40°C ~ 125°C (TJ) | 529-BGA (19x19) | ARM® Cortex®-A8 | 1.2V,1.875V,2.775V,3.0V | 600MHz | 1 Core,32-Bit | Multimedia; NEON® SIMD | LPDDR,DDR2 | Yes | Keypad,LCD | 10/100 Mbps (1) | USB 2.0 (3),USB 2.0 + PHY (1) | ARM TZ,Boot Security,Cryptography,RTIC,Secure Fusebox,Secure JTAG,Secure Memory,Secure RTC | ||||
NXP USA Inc. |
Consulta
|
- |
-
|
MOQ: 750 MPQ: 1
|
IC MPU I.MX51 600MHZ 529BGA
|
Tape & Reel (TR) | i.MX51 | -40°C ~ 95°C (TC) | 529-BGA (19x19) | ARM® Cortex®-A8 | 1.2V,1.875V,2.775V,3.0V | 600MHz | 1 Core,32-Bit | Multimedia; NEON® SIMD | LPDDR,DDR2 | Yes | Keypad,LCD | 10/100 Mbps (1) | USB 2.0 (3),USB 2.0 + PHY (1) | ARM TZ,Boot Security,Cryptography,RTIC,Secure Fusebox,Secure JTAG,Secure Memory,Secure RTC | ||||
NXP USA Inc. |
Consulta
|
- |
-
|
MOQ: 420 MPQ: 1
|
IC MPU I.MX51 600MHZ 529BGA
|
Tray | i.MX51 | -40°C ~ 125°C (TJ) | 529-BGA (19x19) | ARM® Cortex®-A8 | 1.2V,1.875V,2.775V,3.0V | 600MHz | 1 Core,32-Bit | Multimedia; NEON® SIMD | LPDDR,DDR2 | Yes | Keypad,LCD | 10/100 Mbps (1) | USB 2.0 (3),USB 2.0 + PHY (1) | ARM TZ,Boot Security,Cryptography,RTIC,Secure Fusebox,Secure JTAG,Secure Memory,Secure RTC | ||||
NXP USA Inc. |
Consulta
|
- |
-
|
MOQ: 420 MPQ: 1
|
IC MPU I.MX51 600MHZ 529BGA
|
Tray | i.MX51 | -40°C ~ 95°C (TC) | 529-BGA (19x19) | ARM® Cortex®-A8 | 1.2V,1.875V,2.775V,3.0V | 600MHz | 1 Core,32-Bit | Multimedia; NEON® SIMD | LPDDR,DDR2 | Yes | Keypad,LCD | 10/100 Mbps (1) | USB 2.0 (3),USB 2.0 + PHY (1) | ARM TZ,Boot Security,Cryptography,RTIC,Secure Fusebox,Secure JTAG,Secure Memory,Secure RTC | ||||
NXP USA Inc. |
Consulta
|
- |
-
|
MOQ: 84 MPQ: 1
|
IC MPU I.MX51 800MHZ 529MAPBGA
|
Tray | i.MX51 | -20°C ~ 85°C (TC) | 529-BGA (19x19) | ARM® Cortex®-A8 | 1.2V,1.875V,2.775V,3.0V | 800MHz | 1 Core,32-Bit | Multimedia; NEON® SIMD | LPDDR,DDR2 | Yes | Keypad,LCD | 10/100 Mbps (1) | USB 2.0 (3),USB 2.0 + PHY (1) | Boot Security,Cryptography,Hardware ID,RTIC,Secure JTAG | ||||
NXP USA Inc. |
Consulta
|
- |
-
|
MOQ: 750 MPQ: 1
|
IC MPU I.MX51 800MHZ 529BGA
|
Tape & Reel (TR) | i.MX51 | -20°C ~ 85°C (TC) | 529-BGA (19x19) | ARM® Cortex®-A8 | 1.2V,1.875V,2.775V,3.0V | 800MHz | 1 Core,32-Bit | Multimedia; NEON® SIMD | LPDDR,DDR2 | No | Keypad,LCD | 10/100 Mbps (1) | USB 2.0 (3),USB 2.0 + PHY (1) | ARM TZ,Boot Security,Cryptography,RTIC,Secure Fusebox,Secure JTAG,Secure Memory,Secure RTC | ||||
NXP USA Inc. |
Consulta
|
- |
-
|
MOQ: 750 MPQ: 1
|
IC MPU I.MX51 600MHZ 529BGA
|
Tape & Reel (TR) | i.MX51 | -40°C ~ 95°C (TC) | 529-BGA (19x19) | ARM® Cortex®-A8 | 1.2V,1.875V,2.775V,3.0V | 600MHz | 1 Core,32-Bit | Multimedia; NEON® SIMD | LPDDR,DDR2 | No | Keypad,LCD | 10/100 Mbps (1) | USB 2.0 (3),USB 2.0 + PHY (1) | ARM TZ,Boot Security,Cryptography,RTIC,Secure Fusebox,Secure JTAG,Secure Memory,Secure RTC | ||||
NXP USA Inc. |
Consulta
|
- |
-
|
MOQ: 750 MPQ: 1
|
IC MPU I.MX51 800MHZ 529BGA
|
Tape & Reel (TR) | i.MX51 | -20°C ~ 85°C (TC) | 529-BGA (19x19) | ARM® Cortex®-A8 | 1.2V,1.875V,2.775V,3.0V | 800MHz | 1 Core,32-Bit | Multimedia; NEON® SIMD | LPDDR,DDR2 | No | Keypad,LCD | 10/100 Mbps (1) | USB 2.0 (3),USB 2.0 + PHY (1) | ARM TZ,Boot Security,Cryptography,RTIC,Secure Fusebox,Secure JTAG,Secure Memory,Secure RTC | ||||
NXP USA Inc. |
Consulta
|
- |
-
|
MOQ: 750 MPQ: 1
|
I.MX 6 SERIES 32-BIT MPU ARM CO
|
Tape & Reel (TR) | i.MX6SX | -40°C ~ 125°C (TJ) | 529-MAPBGA (19x19) | ARM® Cortex®-A9,ARM® Cortex®-M4 | 1.8V,2.5V,2.8V,3.15V | 200MHz,800MHz | 2 Core,32-Bit | Multimedia; NEON® MPE | LPDDR2,LVDDR3,DDR3 | Yes | Keypad,LCD,LVDS | 10/100/1000 Mbps (2) | USB 2.0 + PHY (1),USB 2.0 OTG + PHY (2) | A-HAB,ARM TZ,CAAM,CSU,SNVS,System JTAG,TVDECODE | ||||
NXP USA Inc. |
Consulta
|
- |
-
|
MOQ: 750 MPQ: 1
|
I.MX6SX ROM PERF ENHAN
|
Tape & Reel (TR) | i.MX6SX | -40°C ~ 125°C (TJ) | 529-MAPBGA (19x19) | ARM® Cortex®-A9,ARM® Cortex®-M4 | 1.8V,2.5V,2.8V,3.15V | 200MHz,800MHz | 2 Core,32-Bit | Multimedia; NEON® MPE | LPDDR2,LVDDR3,DDR3 | Yes | Keypad,LCD,LVDS | 10/100/1000 Mbps (2) | USB 2.0 + PHY (1),USB 2.0 OTG + PHY (2) | A-HAB,ARM TZ,CAAM,CSU,SNVS,System JTAG,TVDECODE |